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The IRG4BC30W-SPBF is a single N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by Infineon Technologies. It features a collector-to-emitter breakdown voltage of 600 V and a continuous collector current rating of 23 A at a case temperature of 25°C, decreasing to 12 A at 100°C. The device supports a pulsed collector current of 92 A and operates within a junction temperature range of -55°C to +150°C. Maximum power dissipation is rated at 100 W at 25°C case temperature, dropping to 42 W at 100°C. The component utilizes a D2PAK surface-mount package with a thermal resistance from junction to case of 1.2 °C/W.
Verify the specific ordering suffix against official documentation to confirm package type and lead-free status. Confirm that the manufacturer designation aligns with current Infineon product lines, as historical naming conventions may vary. Ensure the component meets RoHS compliance requirements for your assembly process. Cross-reference the datasheet revision date to validate electrical characteristics against your design specifications.
Select this component for designs requiring high efficiency in hard-switched modes up to 150 kHz or resonant mode switching above 300 kHz. Consider the thermal management capabilities provided by the D2PAK package and the specified junction-to-case thermal resistance. Evaluate the gate charge parameters to ensure compatibility with available driver circuits for optimal switching performance.
This IGBT belongs to a family of devices optimized for high-frequency operation in power conversion systems. It represents an evolution in IGBT technology aimed at reducing conduction and switching losses compared to previous generations. The component is engineered to provide cost-effective operation while maintaining robust performance in demanding power electronics environments.
Consult official cross-reference guides for verified substitutes. Ensure any replacement matches the 600V voltage rating, D2PAK package dimensions, and thermal characteristics. Verify that alternative components meet the same switching loss and conduction voltage specifications for direct integration.