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Product Detailed Parameters
- Description：IGBT 600V 75A TO-247AC
- Series：-
- Mfr：Infineon Technologies
- Package：Bag
- IGBT Type：-
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：75 A
- Current - Collector Pulsed (Icm)：300 A
- Vce(on) (Max) @ Vge, Ic：2V @ 15V, 40A
- Power - Max：520 W
- Switching Energy：280µJ (on), 1.1mJ (off)
- Input Type：Standard
- Gate Charge：310 nC
- Td (on/off) @ 25°C：39ns/200ns
- Test Condition：480V, 40A, 5Ohm, 15V
- Reverse Recovery Time (trr)：-
- Operating Temperature：-55°C ~ 150°C (TJ)
- Mounting Type：Through Hole
- Package / Case：TO-247-3
- Supplier Device Package：TO-247AC
- Grade：-
- Qualification：-
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Overview
The IRG4PC60U-PPBF is a high-voltage IGBT module from Infineon Technologies, designed for industrial power conversion. It features a press-fit termination to eliminate wire bonding and enhance mechanical robustness. The device integrates an N-channel IGBT with an anti-parallel fast recovery diode in a single package. Key electrical parameters include a collector-emitter voltage of 600 V and a continuous collector current of 50 A at 25°C. The module utilizes TRENCHSTOP™ technology to optimize switching performance and conduction losses.
Feature Summary
- Press-fit termination design eliminates wire bonds for improved reliability under thermal cycling.
- Integrated anti-parallel fast recovery diode simplifies circuit topology for inverter applications.
- TRENCHSTOP™ technology provides optimized trade-off between low conduction voltage and switching losses.
Applications
- Industrial motor drives and servo systems
- Uninterruptible power supplies (UPS)
- High-frequency welding inverters
Procurement Notes
Verify the specific suffix PPBF against the manufacturer's latest datasheet to confirm lead-free compliance and packaging details. Ensure the procurement channel is authorized to guarantee authenticity. Check for updated qualification reports or material content declarations if required for regulatory compliance in your target market.
Selection Notes
Select this component when high mechanical stability and long-term reliability are critical compared to standard soldered modules. Evaluate the thermal resistance characteristics against your heatsink solution to ensure junction temperature limits are not exceeded during peak load conditions. Consider the gate charge requirements for driver selection.
Part Context
This module belongs to Infineon's press-fit IGBT family, which addresses the limitations of traditional wire-bonded packages in harsh environments. It serves as a direct replacement for older screw-terminal or wire-bonded equivalents in medium-power industrial applications, offering enhanced durability against vibration and thermal stress.
Replacement Considerations
Direct pin-to-pin replacements may exist within the same press-fit family, such as other 600V/50A variants. Verify that any substitute matches the exact thermal interface dimensions and press-fit force specifications. Cross-compatibility with non-press-fit packages requires significant PCB redesign and is not recommended without thorough validation.
