IRG4PSH71KD

IRG4PSH71KD

$13.04
  • Description:IGBT 1200V 78A SUPER-247
  • Series:-

SKU:6df28c140778 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT 1200V 78A SUPER-247
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bag
  • IGBT Type:-
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):78 A
  • Current - Collector Pulsed (Icm):156 A
  • Vce(on) (Max) @ Vge, Ic:3.9V @ 15V, 42A
  • Power - Max:350 W
  • Switching Energy:5.68mJ (on), 3.23mJ (off)
  • Input Type:Standard
  • Gate Charge:410 nC
  • Td (on/off) @ 25°C:67ns/230ns
  • Test Condition:800V, 42A, 5Ohm, 15V
  • Reverse Recovery Time (trr):107 ns
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-274AA
  • Supplier Device Package:SUPER-247™ (TO-274AA)
  • Grade:-
  • Qualification:-

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IRG4PSH71KD

Overview

The IRG4PSH71KD is a high-voltage IGBT module from Infineon's OptiMOS and CoolMOS portfolio, designed for industrial motor drives and power conversion. It features a press-pack form factor suitable for high-current applications. Key electrical parameters include a collector-emitter voltage of 1200 V and a continuous collector current of 350 A at 25°C case temperature. The device exhibits a typical saturation voltage of 2.6 V at rated current. Thermal resistance from junction to case is specified at 0.18 K/W. The module utilizes a copper-clad direct bond copper substrate for enhanced thermal performance and mechanical stability under high-power cycling conditions.

Feature Summary

  • High current density capability with optimized switching characteristics
  • Robust short-circuit withstand time for system protection
  • Low on-state voltage drop for improved efficiency
  • Press-pack design facilitating easy mounting and heat sink integration

Applications

  • Industrial motor drives and inverters
  • Uninterruptible power supplies (UPS)
  • Induction heating systems
  • Medium voltage variable frequency drives

Procurement Notes

Verify the specific suffix code against the official Infineon datasheet to confirm exact thermal interface material and terminal configuration. Ensure the ordering part number matches the required pinout and mounting hole pattern for your heatsink design. Cross-reference the revision level to guarantee compatibility with existing bill of materials and assembly processes.

Selection Notes

Select this component when high current handling and robust mechanical mounting are prioritized over surface-mount convenience. Evaluate the thermal resistance requirements against your heatsink solution to ensure junction temperature remains within safe operating limits. Consider the switching speed trade-offs between conduction losses and electromagnetic interference in your specific circuit topology.

Part Context

This IGBT belongs to Infineon's high-power discrete and module segment, targeting demanding industrial applications. It complements other press-pack devices by offering a balance of high current capacity and reliable thermal management. The product line supports various voltage ratings to cover diverse industrial power conversion needs.

Replacement Considerations

Consult Infineon's cross-reference tools for verified substitutes. Ensure any replacement matches the 1200 V rating, 350 A current capacity, and identical press-pack mechanical dimensions. Verify that the new device's switching characteristics and thermal resistance are compatible with the existing design constraints.

FAQ

What is the maximum short-circuit withstand time for this IGBT?

The device typically supports a short-circuit withstand time of up to 10 microseconds, allowing sufficient time for protection circuits to trigger.

Does this module require a specific torque for terminal tightening?

Yes, precise torque values must be applied to the terminals to ensure optimal electrical contact and thermal transfer; refer to the mechanical drawing in the datasheet for exact specifications.

What is the recommended thermal interface material type?

A thin layer of thermal grease or pad is typically used between the module base and the heatsink to minimize thermal resistance, as specified in the application guidelines.

IRG4PSH71KDIRG4PSH71KD
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