IRG4PSH71UDPBF

Overview

The IRG4PSH71UDPbF is a Generation 4 UltraFast Copack IGBT featuring an integrated HEXFRED antiparallel diode. It offers a collector-to-emitter voltage of 1200 V and continuous collector current ratings of 99 A at 25°C case temperature and 50 A at 100°C. The device utilizes the Super-247 package, providing increased creepage distance to 5.35 mm and higher power handling compared to standard TO-247 packages. Switching characteristics are optimized for hard switching frequencies between 8 kHz and 40 kHz, and up to 200 kHz in resonant soft-switching applications.

Feature Summary

• Generation 4 IGBT design ensures tighter parameter distribution and minimized switching and conduction losses for maximum efficiency.
• Integrated HEXFRED antiparallel diode significantly reduces switching losses and electromagnetic interference (EMI).
• Super-247 package architecture delivers double the power handling capability of the TO-247 footprint while occupying less space than the TO-264.

Applications

• High-efficiency motor drives and industrial inverters
• Resonant mode soft-switching power supplies
• Hard-switching applications operating between 8 kHz and 40 kHz

Procurement Notes

Verify the component matches the exact part number IRG4PSH71UDPbF, specifically confirming the 'P' suffix indicates lead-free compliance as per manufacturer marking standards. Ensure the supplier provides documentation confirming the Super-247 package type and Generation 4 technology status. Cross-reference datasheet revision dates to confirm electrical parameters align with current specifications.

Selection Notes

Select this component when high power density and superior thermal performance are required within a compact form factor. The Super-247 package allows for designs needing twice the power handling of a standard TO-247 without increasing board space. Consider this device for applications demanding optimized switching speeds in both hard and resonant soft-switching topologies to minimize system losses.

Part Context

This device belongs to Infineon's Generation 4 IGBT family, representing an evolution from previous iterations with improved efficiency and parameter consistency. It is designed as a copack solution, integrating the IGBT die with a specialized antiparallel diode to enhance overall system performance. The product line targets high-power industrial and consumer markets requiring robust switching capabilities.

Replacement Considerations

Direct replacements must match the 1200 V rating, Super-247 package dimensions, and comparable current handling. Verify that alternative devices support similar switching frequencies and possess integrated antiparallel diodes if EMI reduction is critical. Ensure thermal resistance and pinout compatibility are maintained for existing heatsink and PCB layouts.

FAQ

What is the maximum operating junction temperature for the IRG4PSH71UDPbF?

The maximum operating junction temperature is +150 °C.

How does the Super-247 package compare to the standard TO-247?

The Super-247 package offers higher power handling capability, approximately double that of the TO-247, while maintaining a similar footprint and providing an increased creepage distance of 5.35 mm.

Is the IRG4PSH71UDPbF suitable for surface mount applications?

No, the Super-247 package is not recommended for surface mount applications.