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Product Detailed Parameters
- Description：IGBT MOD 600V 90A 298W INT-A-PAK
- Series：-
- Mfr：Infineon Technologies
- Package：-
- IGBT Type：-
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：3V @ 15V, 90A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-
- Mounting Type：Chassis Mount
- Package / Case：INT-A-PAK (3 + 4)
- Supplier Device Package：INT-A-PAK
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：90 A
- Power - Max：298 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：5.8 nF @ 30 V
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Overview
The IRGTI090U06 is a half-bridge IGBT module manufactured by Infineon Technologies. It features a collector-emitter breakdown voltage of 600 V and a continuous collector current rating of 90 A. The device is housed in an INT-A-PAK package with chassis mounting capabilities. Maximum power dissipation is specified at 298 W. This component is designed for high-power switching applications requiring robust thermal management and reliable performance in industrial environments.
Feature Summary
- Half-bridge configuration integrating two IGBTs for efficient power conversion
- INT-A-PAK package design optimized for chassis mounting and thermal dissipation
- Rated for 600 V blocking voltage and 90 A continuous current operation
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Inverter systems
Procurement Notes
Verify the obsolete status and RoHS compliance details before procurement, as the component contains lead. Confirm availability through authorized distributors or secondary markets due to end-of-life status. Ensure proper handling procedures are followed for legacy semiconductor components during storage and installation.
Selection Notes
Select this module for applications requiring 600 V isolation and 90 A current capacity within a compact chassis-mount form factor. Consider the INT-A-PAK thermal characteristics for heat sink interface design. Evaluate system requirements against the 298 W power dissipation limit to ensure adequate cooling solutions are implemented for sustained operation.
Part Context
This part belongs to Infineon's historical IGBT module portfolio, specifically utilizing the INT-A-PAK packaging technology. It represents a legacy solution for medium-power industrial applications. The manufacturer has transitioned focus toward newer generations of silicon carbide and advanced silicon modules, making this specific part number a discontinued item in the current product lineup.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Due to the obsolete status, direct replacements may require evaluating newer Infineon half-bridge modules with compatible voltage and current ratings, such as those from the IKW or IMW series, subject to mechanical and electrical compatibility verification.
