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The IXGH20N60BD1 is a HiPerFAST IGBT with an integrated diode, manufactured by IXYS. It features a 600V collector-emitter breakdown voltage and a continuous collector current of 40A at 25°C. The device utilizes the HDMOSTM process for high current handling and operates within a junction temperature range of -55°C to +150°C. Packaged in the JEDEC TO-247AD standard through-hole format, it offers isolated mounting capabilities.
Verify the specific suffix 'BD1' against the manufacturer's official datasheet to confirm the inclusion of the integrated diode and the exact pinout configuration. Ensure the TO-247AD package dimensions match the target PCB footprint requirements. Confirm RoHS compliance status for the specific production batch before integration into final assemblies.
Select this component for designs requiring combined switching and freewheeling functions in a compact form factor. The TO-247AD package supports high power density applications. Consider the thermal resistance characteristics when designing heatsinking solutions for continuous operation at rated currents.
This part belongs to the IXYS HiPerFAST family, which employs advanced HDMOSTM processing. The series is designed for high-frequency applications where space savings and high power density are critical. The TO-247AD package is a standard industrial form factor suitable for robust mechanical mounting.
Cross-reference with other IXYS HiPerFAST devices in the TO-247AD package that specify both IGBT and diode integration. Verify that substitute parts meet or exceed the 600V blocking voltage and 40A current ratings while maintaining compatible switching speeds.