IXGH30N60C2

Overview

The IXYS IXGH30N60C2 is a single N-channel Insulated Gate Bipolar Transistor (IGBT) belonging to the HiPerFAST C2-Class series. It utilizes silicon technology and is housed in a TO-247AD-3 through-hole package with a flange mount configuration. The device features a maximum collector-emitter voltage of 600 V and a continuous collector current rating of 30 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.8 V, a gate-emitter threshold voltage maximum of 5 V, and a maximum fall time of 190 ns. The component operates within a junction temperature range of -55°C to +150°C.

Feature Summary

• HiPerFAST C2-Class high-speed IGBT technology for very high frequency operation
• Square Reverse Bias Safe Operating Area (RBSOA)
• High current handling capability
• MOS gate structure ensuring drive simplicity

Applications

• Power Factor Correction (PFC) circuits
• Uninterruptible Power Supplies (UPS)
• Switched-mode and resonant-mode power supplies
• AC motor speed control
• DC servo and robot drives

Procurement Notes

Verify the specific suffix 'C2' against official IXYS documentation to confirm it denotes the C2-Class high-speed variant rather than other revisions. Check for End-of-Life status or discontinuation notices from Littelfuse/IXYS, as older HiPerFAST models may be phased out. Confirm RoHS compliance details directly from the manufacturer's datasheet before procurement.

Selection Notes

Select this component when designing circuits requiring high-frequency switching capabilities combined with robust current handling. Ensure the thermal management solution supports the specified junction temperature limits up to 150°C. Verify that the gate drive circuitry aligns with the MOS gate requirements and the 1.8 V saturation voltage characteristics for optimal efficiency.

Part Context

This part belongs to the IXYS HiPerFAST family, specifically the C2-Class segment designed for high-speed applications. It serves as a discrete semiconductor switch within power electronics systems. The TO-247AD package provides a standardized form factor for through-hole mounting on printed circuit boards, facilitating integration into industrial and consumer power conversion designs.

Replacement Considerations

Direct substitutes include the IXGH30N60B2D1 and IXGH30N60BD1. Alternative options from other manufacturers include the FGH40N60SMD-F085 by onsemi and the STGW40H65FB by STMicroelectronics. Verify pinout compatibility and electrical parameter overlaps before substitution.