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Product Detailed Parameters
- Description：IGBT MOD 600V 200A 595W SOT227B
- Series：GenX3™
- Mfr：IXYS
- Package：Tube
- IGBT Type：PT
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：1.35V @ 15V, 100A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-55°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SOT-227-4, miniBLOC
- Supplier Device Package：SOT-227B
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：200 A
- Power - Max：595 W
- Current - Collector Cutoff (Max)：650 µA
- Input Capacitance (Cies) @ Vce：14.8 nF @ 25 V
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Overview
The IXGN120N60A3D1 is a single IGBT module from the GenX3 series, designed for power conversion applications. It features a 600V collector-emitter voltage rating and supports a continuous collector current of 200A at 25°C. The device utilizes Planar Technology (PT) and is housed in a SOT-227B chassis mount package. Key electrical parameters include a maximum collector-emitter saturation voltage of 2.2V and a power dissipation capacity of 595W. The module operates within a junction temperature range of -55°C to +150°C.
Feature Summary
- Utilizes IXYS GenX3 technology for optimized switching performance
- Designed for high-current power conversion systems
- Robust chassis mount construction for efficient thermal management
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific suffix 'D1' against the official datasheet to confirm pinout and mechanical dimensions. Ensure the sourcing channel provides genuine IXYS components with traceable documentation. Confirm that the SOT-227B mounting requirements align with the target application's thermal interface specifications before finalizing procurement.
Selection Notes
Select this component for applications requiring a balance of high current handling and moderate voltage blocking in a compact form factor. The GenX3 technology offers improved switching characteristics compared to previous generations. Consider the 595W power dissipation limit when designing the heatsink system to maintain junction temperatures within the specified operational range.
Part Context
This part belongs to the IXGN series of single IGBT modules manufactured by IXYS. It is part of the broader GenX3 product family, which represents next-generation 600V IGBTs. The module integrates a single IGBT chip optimized for efficiency and reliability in medium-power industrial electronics.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with existing circuit designs if considering alternative manufacturers.
