IXGR50N60C2D1

Overview

The IXYS IXGR50N60C2D1 is a single IGBT utilizing PT (Punch-Through) technology, housed in a TO-247AD package. It features a maximum collector-emitter voltage of 600 V and a continuous collector current of 75 A at 25°C. The device has a typical saturation voltage of 2.7 V at 40 A with a 15 V gate drive. Key switching parameters include a turn-on delay of 18 ns, a fall time of 115 ns, and an output capacitance energy loss of 380 µJ under test conditions of 480 V, 40 A, and 2 Ω. The total gate charge is 138 nC, and the component supports junction temperatures up to 150°C.

Feature Summary

• PT (Punch-Through) silicon structure for robust high-voltage performance
• Standard input type compatible with common gate driver circuits
• TO-247AD through-hole packaging designed for efficient thermal dissipation

Applications

• Industrial motor drives and inverters
• Switched-mode power supplies (SMPS)
• High-frequency welding equipment

Procurement Notes

Verify the specific suffix D1 against official manufacturer documentation to confirm pinout and electrical tolerances. Confirm availability status as distribution listings may indicate obsolete or end-of-life status. Ensure the supplier provides original manufacturer traceability to avoid counterfeit components.

Selection Notes

Select this component when a 600 V rating and 75 A continuous current are required in a standard TO-247 form factor. Compare the 2.7 V saturation voltage and 138 nC gate charge against alternative PT IGBTs to balance conduction losses against switching speed requirements for the target application frequency.

Part Context

This part belongs to the IXGH/IXGR series of punch-through IGBTs from IXYS. These devices are engineered for general-purpose high-power switching applications. The numbering convention indicates a 50 Amp class device with a 600 V breakdown voltage within the IXYS portfolio.

Replacement Considerations

Direct replacements include the IXGH50N60C2 and IXGT50N60C2. Verify that substitute packages match the thermal and mechanical requirements of the existing PCB layout.