IXSN52N60AU1

IXSN52N60AU1

  • Description:IGBT MOD 600V 80A 250W SOT227B
  • Series:-

SKU:1001de4cc8ba Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MOD 600V 80A 250W SOT227B
  • Series:-
  • Mfr:IXYS
  • Package:Tube
  • IGBT Type:PT
  • Configuration:Single
  • Vce(on) (Max) @ Vge, Ic:3V @ 15V, 40A
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:SOT-227-4, miniBLOC
  • Supplier Device Package:SOT-227B
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):80 A
  • Power - Max:250 W
  • Current - Collector Cutoff (Max):750 µA
  • Input Capacitance (Cies) @ Vce:4.5 nF @ 25 V

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IXSN52N60AU1

Overview

The IXSN52N60AU1 is a HiPerFAST IGBT module manufactured by IXYS. It integrates an N-channel Insulated Gate Bipolar Transistor with a Fast Recovery Epitaxial Diode (FRED) in a single package. The device utilizes the second-generation HDMOSTM process technology to achieve low saturation voltage and efficient switching characteristics. Designed for high-frequency applications, it offers simplified drive requirements due to its MOS gate structure. The component supports surface mounting and provides space savings by combining two devices into one assembly.

Feature Summary

  • Integrates HiPerFAST IGBT and anti-parallel FRED in one package
  • Utilizes second-generation HDMOSTM process for low VCE(sat)
  • Features soft recovery with low IRM for the integrated diode
  • Supports surface mounting with isolated screw hole

Applications

  • AC motor speed control
  • DC servo and robot drives
  • Uninterruptible power supplies (UPS)
  • Switch-mode and resonant-mode power supplies

Procurement Notes

Verify the specific suffix AU1 against official IXYS documentation to confirm pinout and thermal interface compatibility. Confirm RoHS compliance status as historical data may vary. Ensure the supplier provides valid traceability documents. Check for obsolescence notices or lifecycle changes directly from the manufacturer before finalizing procurement plans.

Selection Notes

Select this component for designs requiring high-frequency switching with integrated freewheeling capabilities. The TO-247AD package facilitates easy mounting via a single screw. Consider the thermal performance of the integrated FRED diode when designing heat sinks. Verify that the gate drive circuitry matches the MOS input requirements for optimal switching speeds.

Part Context

This part belongs to the IXYS HiPerFAST family of power semiconductors. The series is engineered for efficiency in power conversion systems. The integration of the IGBT and diode reduces board space and assembly complexity compared to discrete solutions. It represents a standard solution for medium-power industrial applications.

Replacement Considerations

Check for direct replacements within the IXYS HiPerFAST lineup. Verify pin compatibility and electrical parameters such as VCEO and IC ratings. Ensure thermal resistance values are comparable for existing heatsink designs.

IXSN52N60AU1IXSN52N60AU1

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