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Product Detailed Parameters
- Description：IGBT PT 600V 100A TO-247AD
- Series：GenX3™, XPT™
- Mfr：IXYS
- Package：Tube
- IGBT Type：PT
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：100 A
- Current - Collector Pulsed (Icm)：200 A
- Vce(on) (Max) @ Vge, Ic：2.3V @ 15V, 36A
- Power - Max：600 W
- Switching Energy：720µJ (on), 330µJ (off)
- Input Type：Standard
- Gate Charge：64 nC
- Td (on/off) @ 25°C：24ns/62ns
- Test Condition：360V, 36A, 5Ohm, 15V
- Reverse Recovery Time (trr)：-
- Operating Temperature：-55°C ~ 175°C (TJ)
- Mounting Type：Through Hole
- Package / Case：TO-247-3
- Supplier Device Package：TO-247AD (IXXH)
- Grade：-
- Qualification：-
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Overview
The IXXH50N60C3 is a single silicon Insulated Gate Bipolar Transistor (IGBT) from the IXYS XPT series, housed in a TO-247AD through-hole package. It features a maximum collector-emitter voltage of 600 V and a continuous collector current of 100 A at 25°C. The device exhibits a typical collector-emitter saturation voltage of 2.5 V and supports a power dissipation of 600 W. Operating within a temperature range of -55°C to +150°C, it utilizes XPT technology for optimized performance characteristics.
Feature Summary
- XPT technology implementation for enhanced switching efficiency
- Single configuration suitable for high-power applications
- Through-hole mounting for robust mechanical stability
Applications
- High-frequency power supplies
- Motor control drives
- Induction heating systems
Procurement Notes
Verify component authenticity against manufacturer specifications before integration. Confirm RoHS compliance status via official documentation. Ensure thermal management aligns with the 600 W dissipation rating. Validate gate drive requirements match the specified voltage limits. Cross-reference datasheet revisions to ensure parameter consistency.
Selection Notes
Select this component for designs requiring 600 V blocking capability with moderate current handling. Compare saturation voltage against system loss targets. Evaluate thermal resistance parameters for heatsink sizing. Consider the TO-247AD footprint for PCB layout constraints. Verify compatibility with existing gate driver circuits.
Part Context
This part belongs to the IXYS IXXH50N60 family, which includes variants like IXXH50N60B3D1 and IXXH50N60C3D1. These devices share similar voltage and current ratings but may differ in specific electrical characteristics or packaging details. The C3 suffix typically denotes a specific generation or variant within the XPT product line.
Replacement Considerations
Direct substitutes include IXXH50N60B3D1 and IXXH50N60C3D1. Verify pinout compatibility and thermal interface requirements. Check if alternative variants meet the specific saturation voltage and switching speed needs of the application.
