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The IXXH60N65B4 is a single N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by IXYS. It utilizes Trench GenX4 technology with XPT (Extra Punch-Through) architecture to optimize switching performance and conduction losses. The device features a maximum collector-emitter voltage of 650 V and a continuous collector current of 60 A at 25°C, increasing to 145 A under specific thermal conditions. It operates within a junction temperature range of -55°C to +175°C and dissipates up to 536 W of power. Packaged in a TO-247AD-3 through-hole housing, it includes an integrated anti-parallel diode.
Verify the manufacturer part number against official IXYS documentation to ensure authenticity. Confirm that the component matches the specified TO-247AD-3 package and electrical ratings. Request relevant test reports or certificates of conformity if required for quality assurance purposes.
Select this component for applications requiring high voltage blocking and moderate current handling in a standard through-hole package. Consider the thermal resistance and power dissipation limits when designing heat sinks. Ensure gate drive voltages remain within the specified ±20 V range to prevent damage.
This IGBT belongs to the IXYS Trench GenX4 series, which combines trench gate technology with punch-through design. The series targets efficient power conversion in industrial and consumer electronics. The TO-247AD-3 package provides reliable mechanical mounting and thermal management for discrete power modules.
Direct substitutes include IXXH60N65B4H1 from Littelfuse/IXYS, which shares identical electrical characteristics and pinout compatibility.