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The IXXN200N60B3 is a single-channel Insulated Gate Bipolar Transistor (IGBT) module manufactured by IXYS. It utilizes XPT and GenX3 technologies to achieve optimized switching performance. The device features a maximum collector-emitter voltage of 600 V and a continuous collector current of 280 A. The saturation voltage is specified at 1.7 V when tested at 15 V gate drive and 100 A collector current. It is housed in a SOT-227B-4 (Minibloc) package designed for base mounting. The component supports an operating junction temperature range from -55°C to +175°C, with a maximum power dissipation rating of 940 W.
Verify the specific ordering suffix against official IXYS documentation to confirm exact electrical parameters and packaging details. Ensure that the procurement channel provides valid traceability and authenticity guarantees for semiconductor components. Cross-reference the part number with the manufacturer's latest datasheet to confirm availability status and any potential design changes or obsolescence notices before finalizing purchase orders.
Select this component for circuits requiring a 600 V blocking capability and high current handling up to 280 A. The 1.7 V saturation voltage at 100 A indicates moderate conduction losses suitable for various power conversion topologies. Engineers must ensure the thermal management system can handle the 940 W power dissipation limit within the specified -55°C to +175°C junction temperature range to maintain reliable operation under load conditions.
This IGBT belongs to the IXYS IXXN200 series, which focuses on medium-speed switching applications. The series leverages proprietary XPT and GenX3 technologies to balance low saturation voltage with controlled switching speeds. This specific model represents a single-chip solution in a Minibloc package, targeting industrial power electronics where reliability and high current density are critical requirements.
Direct replacements include the IXXN200N60C3H1, which shares similar voltage and current ratings but may differ in thermal resistance and package variations. Verify pinout compatibility and thermal interface specifications when substituting to ensure proper integration into existing heatsink assemblies without modifying the mechanical footprint.