IXXN200N60B3H1

Overview

The IXXN200N60B3H1 is a single-channel Insulated Gate Bipolar Transistor (IGBT) module manufactured by IXYS. It utilizes XPT technology and belongs to the GenX3 series, designed for medium-speed switching applications. The device features a SOT-227B-4 (Minibloc) package with screw mount installation. Key electrical parameters include a maximum collector-emitter voltage of 600 V and a continuous collector current of 200 A at 25°C. The saturated collector-emitter voltage is typically 1.6 V. The module operates within a junction temperature range of -55°C to +150°C.

Feature Summary

• Incorporates Extreme Light Punch Through (XPT) technology for optimized performance.
• Designed for medium-frequency switching operations in the 10–30 kHz range.
• Utilizes the Minibloc SOT-227B-4 package for efficient thermal management.

Applications

• Industrial motor drives
• Uninterruptible power supplies (UPS)
• High-frequency welding equipment

Procurement Notes

Verify the specific suffix H1 against official datasheets to confirm pinout and terminal configuration compatibility. Ensure the sourcing channel provides original manufacturer documentation to validate authenticity. Cross-reference the part number with current Littelfuse or IXYS product lists, as manufacturing rights may have transferred. Confirm RoHS compliance status through official environmental declarations prior to integration into regulated assemblies.

Selection Notes

Select this component for designs requiring high current density in a compact footprint. The 600 V rating suits low-voltage AC/DC conversion systems. Evaluate thermal resistance requirements against the SOT-227B-4 package capabilities. Compare switching losses and saturation voltage against alternative IGBT modules to ensure efficiency targets are met for the specific load profile.

Part Context

This module is part of the IXYS IXXN200N60 series, which groups similar 600 V IGBTs. The H1 suffix typically denotes specific packaging or terminal variations within the Minibloc family. It shares technological foundations with other GenX3 series devices but differs in current handling and physical dimensions compared to lower-current variants like the IXXP series.

Replacement Considerations

Direct substitutes may include other IXYS Minibloc modules with identical pinouts and electrical ratings. Verify thermal interface material compatibility when replacing. Check if alternative manufacturers offer equivalent XPT-based IGBTs in SOT-227B packages with matching Vce(sat) and current capabilities.