IXYK100N120C3

Overview

The IXYS IXYK100N120C3 is a high-speed N-channel Insulated Gate Bipolar Transistor (IGBT) belonging to the GenX3™ product family. It utilizes XPT™ thin-wafer technology to optimize switching performance and conduction losses. The device features a maximum collector-emitter voltage of 1200 V and a continuous collector current rating of 100 A at 25°C. Packaged in a PLUS247 through-hole configuration, it supports a maximum power dissipation of 1150 W. The component operates within a junction temperature range of -55°C to +175°C and is designed for applications requiring fast switching speeds up to 50 kHz.

Feature Summary

• Incorporates XPT™ thin-wafer technology for optimized trade-off between conduction and switching losses.
• Features GenX3™ trench gate architecture for enhanced switching speed and robustness.
• Utilizes PLUS247 package design for efficient thermal management and reliable mounting.

Applications

• High-frequency power conversion systems
• Industrial motor drives and inverters
• Uninterruptible Power Supply (UPS) units

Procurement Notes

Verify the specific suffix 'C3' against the manufacturer's latest datasheet to confirm pinout compatibility and electrical characteristics. Ensure that the PLUS247 package dimensions match the target PCB footprint and thermal interface requirements. Cross-reference the part number with official IXYS distribution channels to validate authenticity and current production status before finalizing procurement orders.

Selection Notes

Select this component when designing circuits requiring a balance of high voltage blocking capability and moderate current handling in a through-hole format. Consider the 1200 V rating for mains-connected or intermediate DC bus applications. Evaluate the thermal resistance of the PLUS247 package against the expected power dissipation to determine adequate heatsinking solutions for the intended operating environment.

Part Context

This device is part of the IXYS 1200V XPT™ IGBTs GenX3™ series. It shares architectural similarities with other members of the IXYK and IXYN families but differs in current ratings and package types. The GenX3™ generation represents an evolution in trench gate technology aimed at improving efficiency in medium-power switching applications compared to earlier planar designs.

Replacement Considerations

Direct replacements should be sought from the same IXYS GenX3™ series with matching 1200 V and 100 A ratings. Verify that alternative packages maintain equivalent thermal performance and pin configurations to ensure mechanical and electrical interchangeability without redesigning the host circuit board.