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Product Detailed Parameters
- Description：IGBT 900V 310A TO-264
- Series：GenX3™, XPT™
- Mfr：IXYS
- Package：Tube
- IGBT Type：-
- Voltage - Collector Emitter Breakdown (Max)：900 V
- Current - Collector (Ic) (Max)：310 A
- Current - Collector Pulsed (Icm)：840 A
- Vce(on) (Max) @ Vge, Ic：2.7V @ 15V, 140A
- Power - Max：1630 W
- Switching Energy：4.3mJ (on), 4mJ (off)
- Input Type：Standard
- Gate Charge：330 nC
- Td (on/off) @ 25°C：40ns/145ns
- Test Condition：450V, 100A, 1Ohm, 15V
- Reverse Recovery Time (trr)：-
- Operating Temperature：-55°C ~ 175°C (TJ)
- Mounting Type：Through Hole
- Package / Case：TO-264-3, TO-264AA
- Supplier Device Package：TO-264 (IXYK)
- Grade：-
- Qualification：-
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Overview
The IXYK140N90C3 is a GenX3™ XPT™ trench gate IGBT manufactured by IXYS. It features a 900V collector-emitter voltage rating and a continuous collector current of 140A at 25°C, with a short-circuit withstand capability of 10µs. The device utilizes soft switching technology to minimize turn-off losses and electromagnetic interference. It is housed in a TO-264 (D2PAK) package designed for high-power applications requiring robust thermal performance and reliable operation under demanding electrical conditions.
Feature Summary
- GenX3™ XPT™ trench gate technology for optimized switching performance
- Soft switching characteristics reducing turn-off losses and EMI
- Square reverse biased safe operating area (RBSOA)
- High short-circuit withstand capability of 10 microseconds
Applications
- Industrial motor drives and inverters
- Uninterruptible power supply (UPS) systems
- High-frequency power supplies
- Welding equipment
Procurement Notes
Verify the specific ordering suffix and package variant against the official IXYS datasheet to ensure compatibility with the intended thermal management solution. Confirm that the application circuit design accounts for the 10µs short-circuit withstand limit and proper gate drive voltage levels to prevent device failure during transient events.
Selection Notes
Select this component for designs requiring high current handling at 900V with low switching losses. Ensure the PCB layout supports the TO-264 package's thermal dissipation requirements. Consider the gate charge specifications when designing the driver circuit to achieve optimal switching speeds without exceeding maximum ratings.
Part Context
This part belongs to the IXYS GenX3™ family of trench gate IGBTs, which are engineered for efficiency in medium to high-power conversion. The XPT™ (eXtended Plate Technology) layer enables a balance between low conduction voltage and fast, soft switching, making it suitable for modern industrial power electronics where efficiency and reliability are critical.
Replacement Considerations
Direct substitutes include other IXYS 900V GenX3 IGBTs in the TO-264 package, such as the IXYK120N90C3 or IXYK160N90C3, provided current ratings match the system requirements. Cross-brand replacements require careful verification of pinout, thermal resistance, and electrical parameters.
