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The IXYS IXYP30N120C4 is a single N-channel Power MOSFET utilizing XPT (eXtended Plate Technology) and Trench technology. It features a TO-247-3 package designed for through-hole mounting. The device supports a maximum drain-source voltage of 1200 V and a continuous drain current of 30 A at 25°C. Key electrical parameters include a maximum on-resistance of 600 mΩ, a gate threshold voltage range of 3.5 V to 5.5 V, and a total gate charge of 80 nC. Thermal performance is characterized by a junction-to-case thermal resistance of 0.9 K/W and a maximum power dissipation of 400 W. The component operates within a temperature range of -55°C to +175°C.
Verify the specific suffix 'C4' against the manufacturer's latest datasheet to confirm pinout compatibility and RoHS status. Ensure the ordering part number matches the exact package variant required for your PCB footprint. Request the official datasheet directly from IXYS or authorized distributors to validate current production status and lead times before finalizing procurement plans.
Select this component when designing circuits requiring high blocking voltage combined with moderate current handling capabilities. The 1200V rating suits industrial and automotive environments where voltage spikes are common. Compare the 600 mΩ on-resistance against system efficiency targets to determine if heatsinking requirements align with the 400W dissipation limit under expected duty cycles.
This device belongs to the IXYS IXYP series of high-voltage discrete MOSFETs. The series is distinguished by its focus on reliability in harsh electrical environments. The IXYP30N120C4 represents a specific current and voltage class within this lineup, offering a balance between low on-state resistance and fast switching characteristics suitable for medium-power conversion topologies.
Cross-reference with other IXYS models such as the IXFH series or IXFN series for similar voltage and current ratings. Verify that any substitute maintains compatible gate charge levels and thermal resistance values. Check for package pinout equivalence to avoid redesigning the printed circuit board layout during replacement.