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The IXYX200N65B5 is a single N-channel silicon IGBT from IXYS, utilizing XPT Gen5 technology and Trench process. It features a collector-emitter voltage (VCES) of 650 V and a continuous collector current (IC110) of 200 A at TC=110°C. The saturation voltage (VCE(sat)) is typically 1.45 V at IC=100A, VGE=15V. Operating within a junction temperature range of -55°C to 175°C, it offers a maximum power dissipation of 1610 W at TC=25°C. The device is housed in a PLUS-247-3L through-hole package with a thermal resistance (RthJC) of 0.093 °C/W.
Verify the manufacturer part number against Littelfuse or IXYS official documentation to confirm authenticity. Ensure the component matches the specified PLUS-247-3L package outline dimensions. Check datasheet revisions for any updates to electrical characteristics before finalizing procurement specifications.
Select this component for high-power density designs requiring optimized performance in the 5–30 kHz frequency range. Consider the 1.45 V typical VCE(sat) and low gate charge when designing drive circuits. Evaluate the 0.093 °C/W thermal resistance for heat sink requirements to maintain junction temperatures within the 175°C maximum limit.
This device belongs to the IXYS Gen5 XPT IGBT family, designed for high-efficiency power conversion. It integrates advanced trench gate technology with soft-punch-through structures to balance conduction losses and switching performance. The PLUS-247-3L package provides robust mechanical stability and efficient thermal management for industrial power electronics.
Check for direct replacements within the IXYS/IXXX series such as IXXX200N65B4, ensuring pinout compatibility and similar electrical ratings like VCES and IC110. Verify that alternative devices meet the same RBSOA and thermal resistance specifications for the target application.