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MADL-011052-14280W is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE PIN 40V 4W CHIP. Review the specifications below when checking this part for your BOM.
The MADL-011052-14280W is a non-gold doped silicon PIN limiter diode die designed for high signal applications. It features an I-region thickness of 2 µm (2 mils) and a contact diameter of 2.6 x 5.8 mm. Electrical specifications include a breakdown voltage range of 20V to 40V, typical junction capacitance of 0.19 pF at 0V reverse bias, and maximum series resistance of 2.0 Ohms at 500 MHz. The device exhibits a carrier lifetime of 23 ns and a CW thermal resistance of 36°C/W. Nominal performance at 9.4 GHz indicates a recovery time of 7 ns, with incident peak power limiting levels of 50 dBm at 10 dB and 15 dB attenuation.
Verify the specific package suffix against the manufacturer's current ordering guide, as availability varies between chip, flying leads, and ceramic packages. Confirm RoHS compliance status and ensure handling procedures strictly follow the provided application notes to prevent metallization damage during assembly.
Select this non-gold doped variant when minimizing flat leakage power is critical compared to gold-doped alternatives. Evaluate the 2.0 Ohm series resistance and 23 ns carrier lifetime against system requirements for insertion loss and recovery speed. Ensure the 2.6 x 5.8 mm rectangular contact dimensions fit the intended microstrip or ground plane layout.
This component belongs to the MACOM MA4L, MADL, and MADP series of silicon PIN limiter diodes. These devices utilize small and medium I-region lengths to deliver low insertion loss at zero bias while maintaining robust power handling capabilities across microwave frequencies.
MADL-011054-0113W0
It is a non-gold doped device specifically engineered to provide lower flat leakage power, whereas gold-doped versions prioritize faster recovery times.
In the single shunt diode configuration described in the datasheet, a shunt coil provides the DC return path.
The die can be mounted using gold-tin eutectic solder perform, conductive silver epoxy, or via thermo-compression wedge bonding for the top contact.
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