MADP-000402-12530P

RF Diode Overview

The MADP-000402-12530P is a SURMOUNT PIN diode chip manufactured by MACOM Technology Solutions. It utilizes the HMICTM process with silicon pedestals embedded in low-loss glass for superior heat transfer and ruggedness. The device features surface mount capability without wire bonding, offering low parasitic capacitance and inductance. Key electrical specifications include a maximum reverse voltage of -100V, typical total capacitance (CT) of 0.045 pF at 1 GHz, and series resistance (RS) of 5.8 Ohms at 10 mA forward current and 1 GHz. It operates within a temperature range of -55°C to +125°C.

RF Diode Feature Summary

• SURMOUNT construction with silicon pedestals embedded in low-dispersion glass for exceptional thermal management
• Surface mount design eliminating the need for wire bonding
• Silicon nitride passivation and polymer scratch protection for junction safety
• Low parasitic inductance and capacitance optimized for high-frequency switching

RF Diode Applications

• Series, shunt, or series-shunt RF switches handling moderate incident power
• High-frequency switch elements requiring low parasitic inductance
• Applications demanding higher average and peak power handling capabilities

RF Diode Procurement Notes

Verify the specific ordering suffix when purchasing. The base part number MA4SPS402 corresponds to the waffle pack configuration. The suffix 12530P indicates the tape and reel packaging variant. Confirm that the required package type matches the project needs before finalizing orders, as the suffix directly determines the physical delivery format.

RF Diode Selection Notes

Select this component for designs requiring robust silicon-glass PIN diodes with integrated surface mount pads. The vertical conic topology provides lower thermal resistance compared to plastic counterparts. Ensure the circuit layout accommodates the ODS-1253 die dimensions and that mounting techniques align with the recommended soldering profiles for hard or soft substrates.

RF Diode Part Context

This part belongs to the MA4SPS402 product family from MACOM's SURMOUNT line. It represents a specialized silicon-glass PIN diode chip designed for high-reliability microwave applications. The device integrates advanced packaging technologies to enhance power handling and frequency performance beyond standard plastic encapsulated diodes.

RF Diode Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing designs based on pinout, electrical parameters, and thermal characteristics if considering alternative components.