Thermal Management MAX6604ATA+T product image

MAX6604ATA+T

  • Description:IC TEMP SENSOR DDR MEMORY 8TDFN
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tape & Reel (TR)

SKU:5fd6f3259cd4 Category: Brand:

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MAX6604ATA+T is listed in the Thermal Management range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TEMP SENSOR DDR MEMORY 8TDFN. Review the specifications below when checking this part for your BOM.

Thermal Management specifications for MAX6604ATA+T

  • Description:IC TEMP SENSOR DDR MEMORY 8TDFN
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tape & Reel (TR)
  • Function:Temp Monitoring System (Sensor), DIMM DDR Memory
  • Sensor Type:Internal
  • Sensing Temperature:-20°C ~ 125°C
  • Accuracy:±3°C(Max)
  • Topology:-
  • Output Type:2-Wire Serial, I2C/SMBUS
  • Output Alarm:Yes
  • Output Fan:No
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-20°C ~ 125°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:8-WFDFN Exposed Pad
  • Supplier Device Package:8-TDFN (2x3)

Thermal Management datasheet and documents for MAX6604ATA+T

MAX6604ATA+T

Thermal Management Overview

The MAX6604ATA+T is a board-mount temperature sensor IC manufactured by Analog Devices Inc./Maxim Integrated. It belongs to the MAX6604 series and is designed for precision temperature monitoring applications, specifically targeting DDR memory systems. The component utilizes a TDFN-EP-8 surface-mount package with an exposed pad for thermal management. It operates using silicon technology and complies with RoHS standards. The device functions as a dedicated temperature monitor within the broader PMIC and Sensors product categories.

Thermal Management Feature Summary

  • Precision temperature monitoring capability tailored for DDR memory environments
  • Surface-mount integration via TDFN-EP-8 package with exposed thermal pad
  • Compliance with environmental restrictions including RoHS standards

Thermal Management Applications

  • DDR memory temperature monitoring
  • Board-mount thermal sensing
  • Precision temperature control circuits

Thermal Management Procurement Notes

Verify current availability status directly with authorized distributors or the manufacturer, as supply constraints may apply. Confirm the specific tape-and-reel packaging configuration required for automated assembly processes. Ensure the TDFN-EP-8 footprint matches the design layout precisely. Validate that the silicon technology and RoHS compliance meet project specifications before finalizing procurement orders.

Thermal Management Selection Notes

Select this component when precise thermal monitoring of DDR memory modules is required. The TDFN-EP-8 package offers a compact solution for space-constrained designs. Consider the exposed pad for effective heat dissipation in high-density PCB layouts. Verify compatibility with existing board-mount temperature sensor infrastructure and ensure the operating temperature range aligns with system requirements.

Thermal Management Part Context

This part is part of the MAX6604 family from Analog Devices/Maxim Integrated, categorized under Board Mount Temperature Sensor ICs. It serves as a specialized monitor for high-speed memory applications. The series focuses on providing accurate thermal data to prevent overheating in sensitive digital components. It sits within the broader Power Management ICs and Sensors subcategories offered by the manufacturer.

MAX6604ATA+TMAX6604ATA+T

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