MBR30080CT

Diode Arrays Overview

The GeneSiC Semiconductor MBR30080CT is a silicon power Schottky diode module rated for an average forward current of 300 A and a repetitive peak reverse voltage of 80 V. It utilizes a Twin Tower package with screw mount installation, offering a thermal resistance of 0.40 °C/W per leg. The device operates within a junction temperature range of -55 °C to +150 °C and supports a peak forward surge current of 2000 A.

Diode Arrays Feature Summary

• High surge capability
• Twin Tower package design
• Not ESD sensitive

Diode Arrays Applications

• Power supply output rectification
• Power management systems
• Instrumentation

Diode Arrays Procurement Notes

Verify the specific part number suffix against official documentation, as variants such as MBR30080CTR exist with reversed leads. Confirm availability status, as this component may be discontinued or subject to limited distribution. Ensure the selected unit matches the required terminal configuration for your assembly process.

Diode Arrays Selection Notes

Select this module for applications requiring high current handling in a compact form factor. The low thermal resistance facilitates efficient heat dissipation in high-power environments. Verify that the system's operating voltage remains below the 80 V rating and that thermal management solutions can maintain the junction temperature within the specified limits.

Diode Arrays Part Context

This component belongs to the MBR300 series of silicon power Schottky diodes from GeneSiC Semiconductor. The series includes variants ranging from 45 V to 100 V reverse voltage ratings, all sharing similar mechanical dimensions and electrical characteristics tailored for high-efficiency power conversion applications.

Diode Arrays Replacement Considerations

Direct substitutes include other models within the MBR300 series, such as MBR30060CT or MBR300100CT, provided the voltage ratings align with system requirements. Cross-referencing with equivalent modules from other manufacturers requires verifying identical current ratings, package dimensions, and thermal performance.