MBRB10200CT-TP

Diode Arrays Overview

The MBRB10200CT-TP is a dual Schottky barrier rectifier manufactured by Micro Commercial Components. It features a Dual Anode Common Cathode configuration housed in a D2PAK-2 (TO-263-2) surface-mount package. The device utilizes silicon technology and supports an average forward current of 10 A with a maximum repetitive reverse voltage of 200 V. Key electrical parameters include a typical forward voltage of 930 mV, a reverse leakage current of 10 uA, and a non-repetitive peak forward surge current capability of 120 A.

Diode Arrays Feature Summary

• Dual Anode Common Cathode configuration for efficient bridge rectification or polarity protection applications
• Low forward voltage drop characteristic to minimize conduction losses and improve system efficiency
• High purity epoxy encapsulation designed for enhanced mechanical strength and moisture resistance

Diode Arrays Applications

• DC-DC converters requiring low loss rectification
• Polarity protection circuits in power supply inputs
• Free-wheeling diodes in inductive load switching applications

Diode Arrays Procurement Notes

Verify the specific suffix 'TP' against the manufacturer's latest documentation to confirm compliance with RoHS and REACH standards. Confirm that the D2PAK-2 footprint matches your PCB design constraints. Check for any recent product change notices regarding pinout or material composition updates before finalizing procurement.

Diode Arrays Selection Notes

Select this component when a dual common cathode arrangement is required within a single surface-mount package. Ensure the thermal management strategy accounts for the D2PAK-2 package's heat dissipation capabilities under continuous 10 A load conditions. Verify that the 200 V reverse voltage rating provides sufficient margin for the application's peak inverse voltage spikes.

Diode Arrays Part Context

This part belongs to the MBRB series of high-efficiency Schottky rectifiers from Micro Commercial Components. The series is characterized by its use of silicon planar technology and robust packaging suitable for automated surface-mount assembly processes. It serves as a specialized alternative to discrete single-diode solutions where space saving and circuit simplicity are priorities.

Diode Arrays Replacement Considerations

Cross-reference with Diodes Incorporated MBRB10200CT-13 for functional equivalence in dual common cathode configurations. Verify pin compatibility and thermal performance characteristics before substitution.