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MBRD20200CT-13 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is DIODE ARR SCHOT 200V 10A TO2523. Review the specifications below when checking this part for your BOM.
The MBRD20200CT-13 is a Schottky Barrier Rectifier manufactured by Diodes Incorporated, designed for commercial applications. It features a TO252 (DPAK) package with a maximum repetitive reverse voltage of 200 V and an average rectified output current of 10 A per leg (20 A total). The device exhibits a low forward voltage drop of 0.90 V maximum at +25°C and 10 A. It supports a non-repetitive peak forward surge current of 150 A and operates within a temperature range of -55°C to +150°C.
Verify the specific ordering suffix '-13' corresponds to the reel packing quantity of 2,500 pieces as documented. Confirm that the TO252 (DPAK) Type TH package matches the required footprint for the target PCB layout. Ensure compliance with RoHS and halogen-free requirements if mandated by the end-use environment.
Select this component when a surface-mount Schottky rectifier with high surge tolerance is required. The dual common cathode configuration allows for efficient use of board space in bridge or free-wheeling circuits. Consider the thermal resistance values for heat dissipation planning in enclosed environments.
This part belongs to the MBRD20200CT series of Schottky Barrier Rectifiers from Diodes Incorporated. It is distinct from through-hole variants like the MBR20200CT due to its surface-mount TO252 packaging. The product is qualified to JEDEC standards for high reliability and is suitable for general commercial electronics.
Direct replacements must match the 200V rating, 10A/leg current capacity, and TO252 package. Verify pinout compatibility, specifically the common cathode configuration. Check thermal characteristics and forward voltage specifications to ensure equivalent performance in the circuit.
The maximum operating junction temperature is +150°C.
Yes, it utilizes guard ring die construction for transient protection.
The typical thermal resistance from junction to case is 6 °C/W.
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