Diode Arrays MBRF300100 product image

MBRF300100

  • Description:DIODE MOD SCHOTTKY 100V TO-244AB
  • Series:-

SKU:d73976ecc80d Category: Brand:

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MBRF300100 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOTTKY 100V TO-244AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for MBRF300100

  • Description:DIODE MOD SCHOTTKY 100V TO-244AB
  • Series:-
  • Mfr:GeneSiC Semiconductor
  • Package:Bulk
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):100 V
  • Current - Average Rectified (Io) (per Diode):150A
  • Voltage - Forward (Vf) (Max) @ If:840 mV @ 150 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:1 mA @ 100 V
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Mounting Type:Chassis Mount
  • Package / Case:TO-244AB
  • Supplier Device Package:TO-244AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for MBRF300100

MBRF300100

Diode Arrays Overview

The MBRF300100 is a silicon Schottky diode module manufactured by GeneSiC Semiconductor. It features a dual common cathode configuration housed in a Twin Tower package designed for screw mounting. The device supports a maximum repetitive reverse voltage of 100 V and an average forward current of 300 A per diode. The typical forward voltage drop is 880 mV at 150 A, with a maximum reverse leakage current of 1 mA at 20 V. Operating temperatures range from -55°C to +150°C.

Diode Arrays Feature Summary

  • Dual common cathode Schottky rectifier architecture
  • High thermal stability up to 150°C junction temperature
  • Low forward voltage drop for improved efficiency
  • Robust screw-mount Twin Tower packaging

Diode Arrays Applications

  • DC-DC converter modules
  • Free-wheeling rectification in motor drives
  • Industrial power supply units
  • Uninterruptible power systems (UPS)

Diode Arrays Procurement Notes

Verify the specific suffix against official GeneSiC documentation to confirm exact electrical tolerances and pinout configurations. Confirm availability status as distribution channels may list obsolete or discontinued variants. Ensure the procurement source provides valid RoHS compliance certificates and original manufacturer traceability for quality assurance purposes.

Diode Arrays Selection Notes

Select this component for applications requiring high current handling with low switching losses. The Twin Tower package facilitates efficient heat dissipation through direct chassis mounting. Compare the 100 V rating against peak inverse voltage requirements in the target circuit to ensure adequate safety margins under transient conditions.

Diode Arrays Part Context

This module belongs to the MBR series of silicon power Schottky diodes from GeneSiC Semiconductor. The series is engineered for high-efficiency power conversion applications where low forward voltage and fast recovery characteristics are critical. The Twin Tower form factor is standard for high-current industrial power modules.

Diode Arrays Replacement Considerations

Cross-reference with MBRT300100 or MBR400100CT for similar specifications. Verify that substitute parts match the Twin Tower footprint and screw mounting dimensions. Ensure replacement devices maintain equivalent current ratings and thermal performance characteristics.

MBRF300100MBRF300100

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