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MBRP1545NTU is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is DIODE ARR SCHOTT 45V 15A TO2203. Review the specifications below when checking this part for your BOM.
The MBRP1545NTU is a silicon Schottky barrier rectifier manufactured by onsemi, formerly Fairchild Semiconductor. It features a dual anode common cathode configuration housed in a TO-220-3 through-hole package. The device supports a continuous forward current of 15 A and a repetitive peak reverse voltage of 45 V. Key electrical characteristics include a maximum forward voltage drop of 800 mV and a non-repetitive peak forward surge current of 150 A. The component operates within a junction temperature range of -65 °C to +150 °C.
Verify the End-of-Life (EOL) status with the manufacturer before procurement, as this component may be discontinued or subject to obsolescence. Confirm RoHS compliance details via official datasheets. Ensure the TO-220-3 package dimensions match your PCB layout requirements. Validate that the 15A current rating and 45V voltage rating align with your specific design constraints.
Select this component for designs requiring a dual diode arrangement in a single through-hole package. The 15A current handling capability makes it suitable for medium-power DC-DC converters. Consider the thermal management requirements associated with the TO-220-3 package. Compare against single-diode alternatives if only one channel is needed to optimize board space.
This part belongs to the MBRP series of Schottky rectifiers from onsemi. It shares the same die specifications as other variants in the family but differs in packaging and internal configuration. The 'NTU' suffix typically denotes the specific through-hole leaded package variant used in industrial and consumer electronics assemblies.
MBR1545CTG: Dual anode common cathode, TO-220-3, 15A, 45V. Note that MBR1545CTG has a higher maximum junction temperature of 175°C compared to the 150°C limit of the MBRP1545NTU. Verify thermal derating curves for both components.
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