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MBRS2545CTH is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARR SCHOTT 45V 25A TO263AB. Review the specifications below when checking this part for your BOM.
The MBRS2545CTH is a dual Schottky rectifier manufactured by Taiwan Semiconductor, designed for high-efficiency power conversion applications. It features a common cathode configuration with two independent anodes within a single package. The device is rated for a continuous forward current of 25 amperes and supports a repetitive peak reverse voltage of 45 volts. It utilizes the SMBR surface-mount package to facilitate automated assembly processes. The component meets AEC-Q101 automotive qualification standards, ensuring reliability in demanding environments.
Verify the specific suffix 'TH' against the manufacturer's latest datasheet to confirm tape-and-reel packaging specifications and pinout orientation. Ensure that the AEC-Q101 qualification status aligns with your project's automotive grade requirements. Cross-reference the SMBR package dimensions with your PCB layout constraints before finalizing procurement orders.
Select this component when a dual Schottky rectifier is required for space-constrained designs. The 25A rating suits moderate-to-high current applications where low forward voltage drop is critical. Consider the thermal performance of the SMBR package relative to your heat dissipation strategy. Verify compatibility with your operating temperature range and reverse voltage stress conditions.
This part belongs to Taiwan Semiconductor's SMBR series of dual Schottky rectifiers. It shares the same electrical core as other variants in the MBR2545 family but differs in packaging and termination style. The SMBR form factor allows for higher density mounting compared to through-hole alternatives like the TO-220AB packages found in similar current-rated devices.
The MBR2545CTG from onsemi offers comparable electrical ratings but uses a through-hole TO-220-3 package, requiring significant PCB layout changes. Direct pin-to-pin replacement is not possible due to the package difference. Evaluate thermal management implications if substituting with any alternative dual Schottky rectifier.
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