MBRT400200R

Diode Arrays Overview

The GeneSiC Semiconductor MBRT400200R is a silicon power Schottky diode module featuring a three-tower package with an electrically isolated base plate. It provides a repetitive peak reverse voltage of 200 V and an average forward current rating of 400 A per package. The device exhibits a maximum instantaneous forward voltage of 0.92 V at 200 A and 150 °C, with a thermal resistance from junction to case of 0.35 °C/W per leg. Operating temperatures range from -55 °C to +150 °C.

Diode Arrays Feature Summary

• High surge capability for robust performance under transient conditions
• Electrically isolated base plate for safe mounting
• Three tower package design for efficient heat dissipation

Diode Arrays Applications

• High frequency switching power supplies
• DC-DC converters
• Free-wheeling rectification in motor drives

Diode Arrays Procurement Notes

Verify the specific suffix 'R' indicates reversed leads as documented in the datasheet. Confirm the exact voltage rating matches the required 200 V specification rather than the 150 V variant. Ensure thermal management solutions align with the specified junction-to-case thermal resistance values for reliable operation.

Diode Arrays Selection Notes

Select this component when high current handling and low forward voltage drop are critical. The isolated base plate simplifies heatsinking without additional insulators. Consider the thermal resistance limits when designing for continuous high-current applications to maintain junction temperature within safe operating areas.

Diode Arrays Part Context

This module belongs to the MBRT400 series of silicon power Schottky rectifiers. It shares the same physical package and thermal characteristics with lower voltage variants like the MBRT400150. The series is designed for high-efficiency power conversion applications requiring rugged semiconductor performance.

Diode Arrays Replacement Considerations

Direct substitutes include other MBRT400 series modules with matching voltage ratings. Verify lead configuration compatibility if replacing non-R variants due to reversed terminal arrangements.