MBRT40045R

Diode Arrays Overview

The GeneSiC Semiconductor MBRT40045R is a silicon power Schottky diode module featuring a three-tower package configuration. It provides an average forward current of 400 A per package and supports a repetitive peak reverse voltage of 45 V. The device incorporates an electrically isolated base plate for mounting flexibility. Key electrical parameters include a maximum instantaneous forward voltage of 0.70 V per leg, a peak forward surge current of 3000 A per leg, and a maximum thermal resistance from junction to case of 0.35 °C/W per leg. The component operates within a temperature range of -55 °C to +150 °C.

Diode Arrays Feature Summary

• High surge capability designed for demanding transient conditions
• Three-tower package structure providing robust mechanical support
• Electrically isolated base plate enabling flexible thermal management

Diode Arrays Applications

• High-current DC-DC converter circuits
• Power factor correction stages in industrial equipment
• Uninterruptible power supply (UPS) systems

Diode Arrays Procurement Notes

Verify the specific datasheet revision and manufacturer documentation before integration. Confirm that the reversed lead configuration associated with the 'R' suffix aligns with the target PCB footprint design. Ensure thermal interface materials are compatible with the specified maximum junction temperature limits during operation.

Diode Arrays Selection Notes

Select this component when high average current handling and low forward voltage drop are required in a single-phase rectification topology. The isolated base plate simplifies heatsinking strategies compared to non-isolated alternatives. Evaluate the thermal resistance specifications against the system's cooling capabilities to maintain safe operating temperatures under continuous load.

Diode Arrays Part Context

This part belongs to the MBRT400 series of silicon power Schottky diodes manufactured by GeneSiC Semiconductor. The series offers various voltage ratings ranging from 45 V to 100 V while maintaining consistent current handling capabilities. The three-tower package design distinguishes these modules from standard dual-tower or single-die configurations.

Diode Arrays Replacement Considerations

MBRT40060R

Diode Arrays FAQ

What does the 'R' suffix indicate in the MBRT40045R designation?

The 'R' suffix indicates that the device features reversed leads compared to the standard configuration.

Is the base plate electrically isolated in this module?

Yes, the module includes an electrically isolated base plate to facilitate mounting options.

What is the maximum thermal resistance from junction to case?

The maximum thermal resistance from junction to case is 0.35 °C/W per leg.