MDD312-16N1

MDD312-16N1

$124.40
  • Description:DIODE MODULE GP 1600V 310A Y1-CU
  • Series:-

SKU:ce72a8dc6101 Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE MODULE GP 1600V 310A Y1-CU
  • Series:-
  • Mfr:IXYS
  • Package:Box
  • Diode Configuration:1 Pair Series Connection
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):1600 V
  • Current - Average Rectified (Io) (per Diode):310A
  • Voltage - Forward (Vf) (Max) @ If:1.32 V @ 600 A
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:30 mA @ 1600 V
  • Operating Temperature - Junction:-40°C ~ 150°C
  • Mounting Type:Chassis Mount
  • Package / Case:Y1-CU
  • Supplier Device Package:Y1-CU
  • Grade:-
  • Qualification:-

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MDD312-16N1

Overview

The IXYS MDD312-16N1 is a silicon diode module designed for high-power applications. It features a Y1-CU package with screw mount installation. The device supports a maximum repetitive reverse voltage of 1.6 kV and conducts an average forward current of 312 A. The typical forward voltage drop is 1.32 V. It operates within a junction temperature range of -40°C to +150°C.

Feature Summary

  • High current capacity suitable for demanding power conversion tasks
  • Robust thermal management via direct screw mounting configuration
  • High voltage blocking capability for industrial grid connections

Applications

  • Industrial rectifier systems
  • DC power supply units
  • Welding equipment inverters

Procurement Notes

Verify the specific suffix N1 against the manufacturer datasheet to confirm pinout and terminal compatibility. Ensure the Y1-CU package dimensions match the heatsink interface requirements. Confirm RoHS compliance status through official documentation before integration into regulated assemblies.

Selection Notes

Select this module when applications require high continuous current handling alongside significant reverse voltage withstand capabilities. The screw mount style necessitates adequate mechanical clamping force and thermal interface material selection. Evaluate thermal resistance parameters to ensure effective heat dissipation under peak load conditions.

Part Context

This component belongs to the MDD312 series of discrete semiconductor modules manufactured by IXYS. The series utilizes silicon technology for robust performance in harsh environments. It serves as a critical switching element in power electronics, replacing older discrete diode arrangements with integrated modular solutions.

Replacement Considerations

The MDD310-16N1 is identified as a potential replacement option. Verify electrical ratings and physical footprint compatibility before substitution.

MDD312-16N1MDD312-16N1
$124.40
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