MDNA700P2200CC

Overview

The MDNA700P2200CC is a high-voltage SCR module manufactured by IXYS, designed for demanding power conversion applications. It features a ComPack-3 package with screw mount installation and operates within a temperature range of -40°C to +125°C. Key electrical specifications include a rated repetitive off-state voltage (VDRM) of 2200 V and an RMS on-state current (It RMS) of 700 A. The device supports a non-repetitive on-state peak current of 19 kA and maintains a maximum holding current (Ih) of 300 mA. Gate triggering requirements are defined by a voltage (Vgt) of 2 V and a current (Igt) of 300 mA.

Feature Summary

• Utilizes DCB ceramic technology within the ComPack-3 package to enhance thermal cycling performance and long-term stability.
• Engineered for high-voltage phase leg configurations in industrial power systems.
• Features a robust silicon construction optimized for reliable operation under extreme electrical stress.

Applications

• High-power industrial motor drives
• HVDC transmission systems
• Large-scale renewable energy inverters

Procurement Notes

Verify the specific suffix against official datasheets to confirm pinout and packaging variations. Confirm RoHS compliance status through manufacturer documentation. Ensure thermal interface materials match the ComPack-3 mounting requirements. Validate gate drive characteristics against the specified 2 V and 300 mA thresholds. Cross-reference part numbers with authorized distributors to avoid counterfeit components.

Selection Notes

Select this component for applications requiring high voltage blocking capability combined with substantial continuous current handling. The ComPack-3 form factor offers industry-standard compatibility for board layout and cooling solutions. Consider the 2200 V rating for systems operating near or above standard medium-voltage levels. Evaluate thermal management needs based on the 700 A RMS current rating and junction temperature limits.

Part Context

This module belongs to the MDNA series of high-power thyristor modules from IXYS. The series is characterized by its use of Direct Bonded Copper (DBC) substrates for improved heat dissipation and mechanical durability. These modules are typically employed in heavy-duty industrial environments where reliability under high electrical stress is critical.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult IXYS technical support for direct equivalents or functional replacements that meet identical voltage and current specifications.