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The MG1225H-XBN2MM is a high-level integrated power module manufactured by Littelfuse. It incorporates an IGBT3 chip utilizing Trench and Field Stop technology, designed for applications requiring fast switching and short tail current characteristics. The device features low saturation voltage with a positive temperature coefficient to enhance thermal stability. Integrated free-wheeling diodes provide fast and soft reverse recovery performance. The module includes solderable pins for printed circuit board mounting and contains an integrated temperature sense feature for precise thermal monitoring.
This component belongs to the MG1225H series of intelligent power modules from Littelfuse. These modules are engineered for compact power conversion solutions. The specific XBN2MM variant represents a configuration within this family, sharing core technological attributes such as the IGBT3 chip architecture and integrated sensing capabilities found across the series.
Publicly confirmed substitute part numbers for the MG1225H-XBN2MM were not identified in the provided documentation. Verification of pin compatibility and electrical ratings is required when considering alternative components.