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The MIS80N120NT1YHE3 is a Trench and Field Stop IGBT manufactured by Micro Commercial Components (MCC). It features a maximum collector-emitter voltage of 1200V and a continuous DC collector current of 80A at 25°C. The device operates within a junction temperature range of -40°C to 150°C. Key electrical parameters include a typical saturation voltage of 1.65V at VGE=15V and IC=33A, and a gate charge of 0.65μC. It utilizes an STO-220 package with a thermal resistance from junction to case of 0.17°C/W.
Verify the authenticity of the component through authorized MCC distributors or direct procurement channels. Counterfeit prevention measures are strictly enforced by the manufacturer. Ensure that the ordering suffix matches the required packaging configuration, as bulk quantities may vary. Confirm RoHS compliance status and lead finish specifications against the latest datasheet revision before finalizing purchase orders.
Select this component based on its 1200V blocking capability and 80A current handling capacity. Consider the thermal resistance characteristics when designing heat dissipation solutions for high-power applications. The positive temperature coefficient aids in current sharing during parallel configurations. Verify switching energy losses against the specific operating frequency and gate resistance requirements of the target circuit design.
This part belongs to the MIS series of trench field stop IGBTs from Micro Commercial Components. It is designed to offer improved reliability and performance compared to standard planar technologies. The inclusion of AEC-Q101 qualification distinguishes it within the broader MCC portfolio by targeting stringent automotive industry requirements for durability and environmental resilience.
No public confirmed substitute part numbers are available in the provided documentation. Engineers should verify pinout compatibility and electrical parameter overlaps if considering alternative manufacturers. Direct replacement requires matching the STO-220 package dimensions and thermal interface specifications.