MIW50N65AH2Y-BP

MIW50N65AH2Y-BP

$1.44
  • Description:IGBT TRENCH FS 650V 80A TO-247AB
  • Series:-

SKU:b18578d1b8ef Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT TRENCH FS 650V 80A TO-247AB
  • Series:-
  • Mfr:MCC (Micro Commercial Components)
  • Package:Tube
  • IGBT Type:Trench Field Stop
  • Voltage - Collector Emitter Breakdown (Max):650 V
  • Current - Collector (Ic) (Max):80 A
  • Current - Collector Pulsed (Icm):200 A
  • Vce(on) (Max) @ Vge, Ic:1.9V @ 15V, 50A
  • Power - Max:283 W
  • Switching Energy:2.05mJ (on), 360µJ (off)
  • Input Type:Standard
  • Gate Charge:140 nC
  • Td (on/off) @ 25°C:24ns/74ns
  • Test Condition:400V, 50A, 10Ohm, 15V
  • Reverse Recovery Time (trr):148 ns
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-247-3
  • Supplier Device Package:TO-247AB
  • Grade:-
  • Qualification:-

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MIW50N65AH2Y-BP

Overview

The MIW50N65AH2Y-BP is a single IGBT utilizing Trench and Field Stop technology, rated at 650 V collector-emitter voltage. It features a continuous collector current of 50 A and a pulsed collector current of 200 A. The device is housed in a TO-247AB package with a maximum power dissipation of 283 W. Operating junction temperature ranges from -40°C to 175°C.

Feature Summary

  • Trench and Field Stop technology for superior current conduction
  • Positive temperature coefficient for Vce(sat)
  • High ruggedness suitable for hard and soft switching

Applications

  • Hard switching applications
  • Soft switching applications
  • Industrial motor drives
  • Power supplies

Procurement Notes

Verify the specific suffix BP against the manufacturer's official documentation to confirm pinout compatibility and thermal characteristics. Ensure the TO-247AB package dimensions match the target PCB footprint. Cross-reference the active status and lead-free compliance with the latest datasheet revision before finalizing procurement orders.

Selection Notes

Select this component when a 650V rating and 50A continuous current are required in a through-hole package. The Trench Field Stop architecture offers improved switching performance compared to standard planar devices. Consider the 283W power dissipation limit and thermal resistance requirements for the intended heat sink design.

Part Context

This part belongs to MCC's discrete semiconductor portfolio, specifically within the IGBT category. It complements other 650V and 1200V IGBTs offered by the manufacturer, providing options for various current ratings and packaging styles to support diverse power electronics designs.

Replacement Considerations

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