MM912F634CV2AP

Application Specific Microcontrollers Overview

The MM912F634CV2AP is an integrated single-package solution combining an HCS12 microcontroller with a SMARTMOS analog control IC. It features a 16-bit S12 CPU with 32 kB FLASH and 2.0 kB RAM, operating at a maximum bus frequency of 20 MHz. The device includes a LIN 2.1 physical layer interface with integrated SCI, six high-voltage/wake-up inputs (L5.0), three low-voltage GPIOs, two protected low-side outputs for inductive loads, and two protected high-side outputs. It supports a -40°C to 105°C temperature range and is housed in a 48-pin LQFP package.

Application Specific Microcontrollers Feature Summary

• Integrated HCS12 MCU with 16-bit S12 CPU, 32 kB Flash, and 2.0 kB RAM
• LIN 2.1 physical layer interface with integrated Serial Communication Interface (SCI)
• Six high-voltage/wake-up inputs and three low-voltage GPIOs
• Two protected low-side outputs and two protected high-side outputs for load driving

Application Specific Microcontrollers Applications

• Automotive door control systems
• Window lifters and seat control applications
• Local Interconnect Network (LIN) connectivity modules

Application Specific Microcontrollers Procurement Notes

Verify the specific ordering suffix 'V2AP' against manufacturer documentation to confirm the exact analog option configuration and package type (non-exposed pad). Ensure compatibility with existing design tools and software libraries within the S12 MagniV product family before procurement.

Application Specific Microcontrollers Selection Notes

Select this component when a combined MCU and relay driver with LIN communication is required. The MM912F634 integrates system base chip functions and application-specific features like current sensing and reverse battery protection. Consider the available analog options regarding wake-up inputs and current sense module availability.

Application Specific Microcontrollers Part Context

The MM912F634 belongs to the S12 MagniV product line from NXP (formerly Freescale). It utilizes a Die-to-Die Interface (D2D) to connect the MCU die with the analog control die, allowing transparent memory mapping and faster access compared to SPI-based systems. This integration simplifies automotive system design by reducing component count.

Application Specific Microcontrollers Replacement Considerations

Check for other derivatives within the MM912F634 series that may offer different analog options or package types (e.g., exposed pad vs. non-exposed pad). Verify pinout and functional compatibility if substituting with other S12 MagniV devices.