MMBD2004SW-7-F

Overview

The MMBD2004SW-7-F is a high voltage surface mount dual switching diode manufactured by Diodes Incorporated. It features a maximum repetitive peak reverse voltage of 300 V and a forward continuous current rating of 225 mA. The device exhibits a fast switching speed with a maximum reverse recovery time of 50 ns and low leakage current, limited to 100 nA at 240 V reverse bias. Power dissipation is rated at 250 mW, and the component operates within a temperature range of -65°C to +150°C.

Feature Summary

• High reverse breakdown voltage capability up to 300 V for robust blocking performance
• Fast switching speed with a maximum reverse recovery time of 50 ns
• Low leakage current characteristics under high reverse bias conditions
• Qualified to AEC-Q101 standards ensuring high reliability for automotive applications

Applications

• General purpose switching circuits requiring high voltage isolation
• Automotive electronics systems adhering to AEC-Q101 reliability standards
• Surface mount assembly processes utilizing automated insertion equipment

Procurement Notes

Verify the specific ordering suffix when sourcing components. The standard part number MMBD2004SW-7-F denotes the standard grade version packaged in tape and reel format. An alternative variant, MMBD2004SWQ-7-F, indicates an automotive-grade component also supplied in tape and reel packaging. Confirm that the required compliance level matches the project specifications before procurement.

Selection Notes

Select this component for designs necessitating high voltage handling in a compact SOT323 package. The 50 ns reverse recovery time supports efficient operation in general purpose switching applications. Ensure thermal management accommodates the 250 mW power dissipation limit. Verify compatibility with automated pick-and-place machinery due to the surface mount configuration.

Part Context

This component belongs to the MMBD series of high voltage surface mount dual switching diodes produced by Diodes Incorporated. The series utilizes a molded plastic case constructed from green molding compound. The device is designed for lead-free soldering processes and complies with RoHS directives. It serves as a compact solution for replacing through-hole equivalents in modern electronic assemblies.

Replacement Considerations

MMBD2004SWQ-7-F