RF Diode MPN7453B-C22 product image

MPN7453B-C22

  • Description:RF DIODE PIN 400V CHIP
  • Series:-

SKU:9d56b08463f7 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

MPN7453B-C22 is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE PIN 400V CHIP. Review the specifications below when checking this part for your BOM.

RF Diode specifications for MPN7453B-C22

  • Description:RF DIODE PIN 400V CHIP
  • Series:-
  • Mfr:MACOM Technology Solutions
  • Package:Tray
  • Diode Type:PIN - Single
  • Voltage - Peak Reverse (Max):400V
  • Current - Max:-
  • Capacitance @ Vr, F:0.2pF @ 50V, 100MHz
  • Resistance @ If, F:900mOhm @ 100mA, 100MHz
  • Power Dissipation (Max):-
  • Operating Temperature:175°C (TJ)
  • Package / Case:Die
  • Supplier Device Package:Chip
  • Grade:-
  • Qualification:-

RF Diode datasheet and documents for MPN7453B-C22

MPN7453B-C22

RF Diode Overview

The MPN7453B-C22 is a high-power silicon PIN diode manufactured by MACOM Technology Solutions. It is designed for RF applications requiring robust performance under high power conditions. The component features a single PIN diode configuration housed in a die package format, suitable for chip-level integration. Key electrical specifications include a maximum peak inverse voltage of 400V and a forward voltage drop of 0.9V at specified current levels. The device supports a maximum junction temperature of 175°C, ensuring reliability in demanding thermal environments. Additional parameters include a capacitance of 0.20pF and an inductance of 8nH, contributing to its high-frequency capabilities.

RF Diode Feature Summary

  • High power handling capability for RF signal switching and attenuation
  • Single PIN diode structure optimized for high-frequency operation
  • Robust thermal performance with a maximum junction temperature of 175°C

RF Diode Applications

  • RF switch circuits
  • Attenuator modules
  • High-power signal processing systems

RF Diode Procurement Notes

Verify the specific datasheet version and manufacturer documentation to confirm all electrical parameters and mechanical dimensions. Ensure that the die package requirements align with your PCB design and assembly processes. Cross-reference part numbers with official MACOM catalogs to avoid counterfeit components. Confirm compliance with relevant environmental standards such as RoHS status before procurement.

RF Diode Selection Notes

Select this component when high power handling and low insertion loss are critical for RF applications. Consider the die package format for custom integration into larger modules. Evaluate thermal management requirements given the 175°C junction temperature limit. Compare electrical characteristics like capacitance and inductance against system specifications to ensure compatibility with target frequencies.

RF Diode Part Context

The MPN7453B-C22 belongs to MACOM's high-power silicon PIN diode family, which includes variants like MPN7453C. These devices are engineered for demanding RF environments where reliability and performance under stress are paramount. The C22 suffix typically denotes specific packaging or testing configurations within the product line, distinguishing it from other series members.

RF Diode Replacement Considerations

Consult official MACOM documentation for direct substitutes. The MPN7453C is listed in related datasheets but has different electrical ratings (e.g., lower peak inverse voltage). Verify compatibility before substitution.

RF Diode FAQ

What is the maximum junction temperature for the MPN7453B-C22?

The maximum junction temperature is 175°C.

Is the MPN7453B-C22 available in a standard surface-mount package?

No, it is supplied as a die for chip-level integration.

MPN7453B-C22MPN7453B-C22

Click on the inquiry