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The Microsemi MSAD200-16 is a glass-passivated rectifier diode module rated for 200 A average forward current and 1600 V repetitive peak reverse voltage. It utilizes an isolated metal baseplate with aluminum oxide ceramic insulation, providing 3000 V isolation. The module features a common anode configuration with two elements in a single-phase setup. Key thermal characteristics include a junction-to-case resistance of 0.21 °C/W per diode and a case-to-sink resistance of 0.05 °C/W. Maximum operating junction temperature reaches 150 °C, with a non-repetitive surge current capability of 6800 A.
Verify the specific suffix to confirm the 1600V rating, as the MSAD200 series includes variants with different blocking voltages such as 800V, 1200V, and 1800V. Ensure the procurement documentation explicitly references the MSAD200-16 part number to avoid confusion with other modules in the MSKD or MSCD families. Confirm that the package outline matches CASE D2 specifications for proper mechanical integration.
Select this component when a high-voltage, high-current rectification solution is required for industrial power applications. The common anode design simplifies circuit topology for specific converter configurations. Consider the thermal management requirements given the 0.21 °C/W junction-to-case resistance. Verify that the system can accommodate the 3000 V isolation requirement between terminals and the heatsink.
This module belongs to the MSAD200 family of glass-passivated rectifier diodes manufactured by Microsemi. The series offers various voltage ratings from 800V to 1800V while maintaining a consistent 200A current rating. These modules are designed for robust performance in demanding power electronics environments, utilizing a standardized CASE D2 package for mounting compatibility.
Direct substitutes within the same family include MSAD200-08 (800V), MSAD200-12 (1200V), and MSAD200-18 (1800V). Cross-family replacements like MSKD200 or MSCD200 share similar electrical ratings but may differ in internal configuration or packaging details. Verify pinout and thermal interface compatibility before substitution.