MSC2X51SDA070J

MSC2X51SDA070J

$40.60
  • Description:DIODE MODULE SIC 700V 50A SOT227
  • Series:-

SKU:748ad90f73b6 Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE MODULE SIC 700V 50A SOT227
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tube
  • Diode Configuration:2 Independent
  • Technology:SiC (Silicon Carbide) Schottky
  • Voltage - DC Reverse (Vr) (Max):700 V
  • Current - Average Rectified (Io) (per Diode):50A (DC)
  • Voltage - Forward (Vf) (Max) @ If:1.8 V @ 50 A
  • Speed:No Recovery Time > 500mA (Io)
  • Reverse Recovery Time (trr):0 ns
  • Current - Reverse Leakage @ Vr:200 µA @ 700 V
  • Operating Temperature - Junction:-55°C ~ 175°C
  • Mounting Type:Chassis Mount
  • Package / Case:SOT-227-4, miniBLOC
  • Supplier Device Package:SOT-227 (ISOTOP®)
  • Grade:-
  • Qualification:-

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MSC2X51SDA070J

Overview

The MSC2X51SDA070J is a Silicon Carbide Schottky Barrier Diode module manufactured by Microchip Technology. It features a dual parallel configuration with two independent diodes housed in a SOT-227 (miniBLOC) package. The device supports a maximum repetitive peak reverse voltage of 700 V and a continuous forward current of 50 A per diode. It utilizes chassis mounting via screw electrical connections, offering high thermal conductivity and zero reverse recovery charge characteristics typical of SiC technology.

Feature Summary

  • Dual independent silicon carbide Schottky barrier diode structure
  • Zero reverse recovery charge for reduced switching losses
  • High thermal conductivity chassis mount design

Applications

  • High-frequency power conversion systems
  • Industrial motor drives
  • Uninterruptible power supplies

Procurement Notes

Verify the specific ordering suffix and package variant against the official Microchip Technology datasheet to ensure compatibility with your system requirements. Confirm that the SOT-227 mounting specifications align with your thermal management strategy. Cross-reference the part number with authorized distributors to validate authenticity and supply chain integrity before finalizing procurement decisions.

Selection Notes

Select this component when designing circuits requiring high-voltage blocking capabilities combined with fast switching speeds. The dual independent configuration allows for flexible topology implementation in bridge or half-bridge arrangements. Ensure the thermal interface material and mounting torque meet the mechanical requirements of the miniBLOC package to maintain optimal heat dissipation performance.

Part Context

This module belongs to Microchip's series of high-power silicon carbide semiconductor devices. These components are engineered for applications demanding superior efficiency and reliability compared to traditional silicon counterparts. The SOT-227 package provides a robust mechanical solution for high-current industrial environments, supporting the thermal and electrical stresses inherent in modern power electronics designs.

Replacement Considerations

Consult official substitution lists for compatible dual-diode SiC modules with matching voltage and current ratings. Verify pinout compatibility and thermal resistance values when considering alternative manufacturers. Ensure that any substitute part meets the same safety and regulatory standards required for the original application.

MSC2X51SDA070JMSC2X51SDA070J
$40.60
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