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MSCC60VRM45TAPG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET 600V 40A SP6-P. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for MSCC60VRM45TAPG
- Description：MOSFET 600V 40A SP6-P
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Technology：-
- Configuration：-
- FET Feature：-
- Drain to Source Voltage (Vdss)：600V
- Current - Continuous Drain (Id) @ 25°C：40A (Tc)
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Power - Max：-
- Operating Temperature：-
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：SP6-P
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for MSCC60VRM45TAPG
FET, MOSFET Arrays Overview
The MSCC60VRM45TAPG is a Power MOSFET module from Microchip Technology, utilizing Silicon technology and housed in the SP6P package. It belongs to the PM-MOSFET-CoolMOS-SP6P product line. The component is classified under discrete and power modules and complies with RoHS standards. It is supplied in tube packaging.
FET, MOSFET Arrays Feature Summary
- Integrates CoolMOS SP6P technology for enhanced switching performance
- Designed as a complete power MOSFET module solution
- Utilizes silicon-based semiconductor construction
FET, MOSFET Arrays Applications
- Power conversion systems requiring integrated MOSFET solutions
- Industrial motor drive applications
- High-efficiency power supply designs
FET, MOSFET Arrays Procurement Notes
Verify the specific datasheet version and any associated Product Change Notifications (PCN) prior to procurement. Confirm that the SP6P package dimensions and pinout align with the target PCB footprint. Ensure compliance with RoHS requirements matches project specifications. Cross-reference the manufacturer part number with official Microchip documentation to confirm current production status and availability constraints.
FET, MOSFET Arrays Selection Notes
Select this module when a compact, high-performance silicon MOSFET solution is required. The SP6P package offers a specific form factor suitable for board-level integration. Consider the CoolMOS SP6P architecture for optimized switching characteristics compared to standard MOSFETs. Verify thermal management requirements based on the module's power dissipation capabilities within the system design.
FET, MOSFET Arrays Part Context
This component is part of Microchip's broader portfolio of discrete and power modules. It falls under the category of power management semiconductors, specifically focusing on power switching applications. The SP6P package is a standardized module format used across various high-power device families from the manufacturer.
Explore related parts through FETs, MOSFETs, Transistors, Discrete Semiconductor Products, all product categories.
