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Product Detailed Parameters
- Description：DIODE MODULE SIC 700V 150A D1P
- Series：-
- Mfr：Microchip Technology
- Package：Box
- Diode Configuration：1 Pair Common Cathode
- Technology：SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max)：700 V
- Current - Average Rectified (Io) (per Diode)：150A
- Voltage - Forward (Vf) (Max) @ If：1.8 V @ 150 A
- Speed：No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr)：0 ns
- Current - Reverse Leakage @ Vr：600 µA @ 700 V
- Operating Temperature - Junction：-40°C ~ 175°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：D1P
- Grade：-
- Qualification：-
Download product information
Overview
The MSCDC150KK70D1PAG is a Silicon Carbide (SiC) Schottky diode module manufactured by Microchip Technology. It features a dual configuration housed in the D1P package with screw mount installation style. The component supports a reverse voltage of 700 V and a forward current of 150 A. It exhibits a forward voltage of 1.5 V and operates within a temperature range from -40°C to +125°C.
Feature Summary
- Utilizes Silicon Carbide technology for high-performance rectification
- Dual configuration design for efficient power conversion
- Robust screw mount construction for secure chassis integration
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Solar inverters
Procurement Notes
Verify the specific suffix D1PAG against official Microchip documentation to confirm package and tape/reel specifications. Ensure thermal management requirements align with the module's operating temperature limits. Confirm RoHS3 compliance status through the manufacturer's latest environmental reports before finalizing procurement orders.
Selection Notes
Select this module for applications requiring high-temperature stability and low forward voltage drop. Compare the 700V rating and 150A current capacity against system load requirements. Evaluate the D1P package dimensions for mechanical fit within the target enclosure. Consider the SiC material properties for efficiency gains over traditional silicon alternatives.
Part Context
This component belongs to Microchip's SiC Schottky Diode Modules product line. It is designed for high-power density applications where efficiency and thermal performance are critical. The D1P package provides a standardized form factor for easy integration into existing power electronics designs.
Replacement Considerations
Consult Microchip's official cross-reference tools for verified substitutes. Ensure any replacement matches the 700V reverse voltage, 150A forward current, and D1P package type. Verify that alternative components maintain equivalent thermal characteristics and switching performance.
