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Product Detailed Parameters
- Description：DIODE MODULE SIC 1200V 600A SP6
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Diode Configuration：1 Pair Series Connection
- Technology：SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max)：1200 V
- Current - Average Rectified (Io) (per Diode)：600A
- Voltage - Forward (Vf) (Max) @ If：1.8 V @ 600 A
- Speed：No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr)：0 ns
- Current - Reverse Leakage @ Vr：2.4 mA @ 1200 V
- Operating Temperature - Junction：-40°C ~ 175°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：SP6
- Grade：-
- Qualification：-
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Overview
The MSCDC600A120AG is a Silicon Carbide (SiC) Schottky Barrier Diode module manufactured by Microchip Technology. It utilizes the SP6C package and features screw mount installation. The device is configured as a dual phase leg with a reverse voltage rating of 1.2 kV and a forward current capacity of 600 A. The typical forward voltage is 1.5 V, and it operates within a temperature range of -40°C to +125°C.
Feature Summary
- Utilizes Silicon Carbide technology for high-temperature operation
- Dual configuration in a single phase leg topology
- Screw mount mechanical interface
Applications
- High-power industrial motor drives
- Renewable energy inverters
- Electric vehicle charging systems
Procurement Notes
Verify the exact part number against official Microchip documentation before procurement. Confirm that the suffix 'AG' corresponds to the specific RoHS-compliant variant required for your assembly process. Ensure the SP6C package dimensions match your thermal management design. Cross-reference the datasheet revision date to confirm technical specifications have not changed.
Selection Notes
Select this component when a high-current SiC diode is required for high-voltage applications. The 600 A rating supports substantial power handling. The 1.2 kV blocking voltage suits medium-voltage systems. Verify compatibility with existing gate drive and cooling infrastructure. Compare thermal resistance values against alternative modules to ensure adequate heat dissipation.
Part Context
This module belongs to Microchip's portfolio of discrete semiconductor power modules. It is part of the broader SiC Schottky diode series designed for efficiency and reliability. The SP6C packaging standardizes mounting across various current ratings within the product family.
Replacement Considerations
Consult official substitution lists for verified equivalents. Check for updated revisions or pin-compatible alternatives with similar electrical characteristics. Do not assume cross-brand compatibility without rigorous validation.
