MSCGLQ75H120CTBL3NG

MSCGLQ75H120CTBL3NG

$195.19
  • Description:PM-IGBT-SBD-BL3
  • Series:-

SKU:6c4220e6cfa7 Category: Brand:

  
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Product Detailed Parameters

  • Description:PM-IGBT-SBD-BL3
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:-
  • Configuration:Full Bridge
  • Vce(on) (Max) @ Vge, Ic:2.4V @ 15V, 75A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):160 A
  • Power - Max:470 W
  • Current - Collector Cutoff (Max):50 µA
  • Input Capacitance (Cies) @ Vce:4.4 nF @ 25 V

Download product information

MSCGLQ75H120CTBL3NG

Overview

The MSCGLQ75H120CTBL3NG is a PM-IGBT-SBD-BL3 power module manufactured by Microchip Technology. It features a full bridge configuration with IGBT and SBD technologies. The maximum collector-emitter voltage (VCEO) is 1200 V. The continuous collector current at 25°C is 75 A. The package dimensions are 108 mm x 67.3 mm x 17.2 mm. The operating temperature range spans from -55°C to +175°C.

Feature Summary

  • Integrated full bridge topology combining IGBT and SBD components
  • High thermal stability supporting operation up to 175°C junction temperature
  • Robust mechanical design suitable for screw mounting applications

Applications

  • Industrial motor drives
  • Uninterruptible power supplies
  • Inverter systems

Procurement Notes

Verify the specific ordering suffix against official Microchip documentation to ensure correct pinout and thermal interface specifications. Confirm RoHS compliance status through the manufacturer's datasheet or product change notifications prior to finalizing procurement plans.

Selection Notes

Select this component for high-voltage applications requiring a 1200 V rating and 75 A continuous current capacity. Ensure the cooling system can handle the specified power dissipation within the -55°C to +175°C operating range. Verify that the SP3 or compatible package footprint matches the PCB layout requirements.

Part Context

This module belongs to Microchip's IGBT module portfolio, specifically utilizing the BL3 packaging format. It represents a discrete power solution designed for medium-power conversion tasks. The device integrates switching and freewheeling elements into a single insulated substrate for improved reliability.

Replacement Considerations

Cross-reference with other Microchip full bridge modules in the 1200 V / 75 A class. Verify mechanical dimensions and terminal configurations before substitution. Consult official replacement lists for any discontinued variants.

MSCGLQ75H120CTBL3NGMSCGLQ75H120CTBL3NG
$195.19
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