MSCGLQ75X120CTYZBNMG

Overview

The MSCGLQ75X120CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module manufactured by Microchip Technology. It integrates IGBT4 transistors with Silicon Carbide (SiC) Schottky diodes in an isolated package featuring a Si3N4 substrate and AlSiC base plate. The device supports a collector-emitter voltage of 1200 V. Continuous collector current ratings vary by function: 150 A for the main bridge and brake IGBTs, 180 A for the soft start IGBT, and 27 A for the solenoid IGBTs. It includes internal electrical shunts and a PTC temperature sensor.

Feature Summary

• Integrates Silicon Carbide Schottky diodes and IGBT4 technology for stable temperature behavior and rugged operation.
• Features low stray inductance design with lead frames for power connections to enable solderable terminals for easy PCB mounting.
• Utilizes a silicon nitride substrate and aluminum silicon carbide base plate to provide low junction-to-case thermal resistance and reduced weight.
• Includes an internal thermistor for precise temperature monitoring within the operating range.

Applications

• Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) systems
• High reliability Power Core Module (PCM)
• Modular power module for Power Drive Electronic (PDE)

Procurement Notes

Verify component authenticity through authorized Microchip Technology distributors or direct channels. Confirm that the ordering suffix matches the specific configuration required for your application. Ensure proper electrostatic discharge handling procedures are followed during storage and installation to prevent damage to the sensitive semiconductor components.

Selection Notes

Select this module when a combined solution for three-phase drive, braking, soft start, and solenoid control is required. Evaluate the continuous current requirements against the specific ratings for each integrated IGBT function. Consider the thermal management capabilities provided by the AlSiC base plate and the isolation voltage specifications for system safety compliance.

Part Context

This component belongs to the MSCGLQ series of hybrid power modules from Microchip Technology. These devices are engineered for high-reliability applications requiring integrated power switching functions. The series combines silicon-based IGBTs with wide-bandgap SiC diodes to optimize performance in demanding electromechanical and power drive environments.

Replacement Considerations

No public confirmed substitute part numbers are available in the official documentation.