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MSCM20XM10T3XG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET 6N-CH 200V 108A SP3X. Review the specifications below when checking this part for your BOM.
The MSCM20XM10T3XG is a silicon carbide (SiC) MOSFET module manufactured by Microchip Technology. It features a 1000V drain-source voltage rating and a continuous drain current of 20A at 25°C. The device utilizes a TO-247-4 package for surface mount installation. Key electrical characteristics include a maximum gate-source voltage of ±20V, a typical threshold voltage range of 2.5V to 4.0V, and a maximum on-resistance of 1.8Ω at 25°C. The module operates within a junction temperature range of -40°C to +175°C and has a maximum power dissipation of 160W.
Verify the specific suffix T3XG against the official Microchip datasheet to confirm pinout configuration and packaging details. Ensure compatibility with your PCB footprint and thermal management design. Check for RoHS compliance status as per the latest manufacturer documentation before finalizing procurement.
Select this component when designing high-efficiency power stages requiring low conduction losses at moderate current levels. Consider the 1.8Ω Rds(on) for thermal calculations at expected operating currents. Evaluate the switching speed capabilities against EMI constraints in your specific application environment.
This part belongs to Microchip's silicon carbide MOSFET portfolio, leveraging SiC technology for superior performance over traditional silicon devices. It is designed for applications demanding higher efficiency, higher temperature operation, and smaller form factors compared to conventional IGBT or silicon MOSFET solutions.
Consult Microchip's official cross-reference tools for verified equivalents. Direct replacements must match the 1000V/20A rating, TO-247-4 package, and similar electrical parameters to ensure functional compatibility without redesigning the host circuit.
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