MSCSM170DUM23T3AG

FET, MOSFET Arrays Overview

The MSCSM170DUM23T3AG is a dual common source silicon carbide (SiC) MOSFET power module rated at 1700V and 124A. It features an aluminum nitride substrate for thermal management, Kelvin sources for low-inductance driving, and an integrated NTC thermistor. Key electrical parameters include a maximum drain-source voltage of 1700V, continuous drain current of 124A at 25°C, typical on-resistance of 17.5mΩ, total gate charge of 356nC, and junction-to-case thermal resistance of 0.25°C/W.

FET, MOSFET Arrays Feature Summary

• Kelvin source configuration enables easy drive with low stray inductance
• Aluminum nitride substrate provides improved thermal performance
• Integrated internal thermistor allows for temperature monitoring
• Isolated package design supports direct mounting to heatsinks

FET, MOSFET Arrays Applications

• AC switches

FET, MOSFET Arrays Procurement Notes

Verify the datasheet revision date against the manufacturer's official records before finalizing specifications. Confirm that the ordering suffix matches the exact pinout and terminal configuration required by your PCB layout. Ensure electrostatic discharge handling procedures are strictly followed during assembly to prevent device damage.

FET, MOSFET Arrays Selection Notes

Select this component when high-frequency operation and robust thermal performance are required. The dual common source topology suits applications needing isolated switching control. Evaluate the 1700V rating against system voltage peaks and ensure the 124A current capacity aligns with load requirements under specified case temperatures.

FET, MOSFET Arrays Part Context

This module belongs to Microchip's silicon carbide power module lineup, designed for high-efficiency power conversion. It utilizes SiC technology to achieve superior switching speeds and lower conduction losses compared to traditional silicon devices. The SP1F package format facilitates integration into compact industrial power systems.

FET, MOSFET Arrays Replacement Considerations

Consult the manufacturer's cross-reference documentation for verified substitute part numbers. Verify compatibility regarding pin assignments, thermal characteristics, and electrical ratings before implementing any alternative components in existing designs.