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MSCSM170TAM15CTPAG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET 6N-CH 1700V 179A. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for MSCSM170TAM15CTPAG
- Description：MOSFET 6N-CH 1700V 179A
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Technology：Silicon Carbide (SiC)
- Configuration：6 N-Channel (Phase Leg)
- FET Feature：-
- Drain to Source Voltage (Vdss)：1700V (1.7kV)
- Current - Continuous Drain (Id) @ 25°C：179A (Tc)
- Rds On (Max) @ Id, Vgs：15mOhm @ 90A, 20V
- Vgs(th) (Max) @ Id：3.2V @ 7.5mA
- Gate Charge (Qg) (Max) @ Vgs：534nC @ 20V
- Input Capacitance (Ciss) (Max) @ Vds：9900pF @ 1000V
- Power - Max：843W (Tc)
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for MSCSM170TAM15CTPAG
FET, MOSFET Arrays Overview
The MSCSM170TAM15CTPAG is a triple phase leg silicon carbide (SiC) MOSFET power module rated at 1700 V and 179 A. It integrates SiC MOSFETs with an internal NTC thermistor for temperature monitoring. Key electrical parameters include a drain-source on-resistance of 11.7 mΩ, a gate threshold voltage of 1.8 V, and a junction-to-case thermal resistance of 0.178 °C/W. The device operates within a junction temperature range of -40 °C to 175 °C.
FET, MOSFET Arrays Feature Summary
- Integrates SiC Schottky diodes featuring zero reverse recovery and positive forward voltage temperature coefficient
- Utilizes aluminum nitride substrate for improved thermal performance and low stray inductance design
- Includes an internal NTC thermistor for precise temperature monitoring
FET, MOSFET Arrays Applications
- Welding converters
- Switched mode power supplies
- Uninterruptible power supplies
- EV motor and traction drive
FET, MOSFET Arrays Procurement Notes
Verify the specific ordering suffix against official Microchip documentation to confirm package type and terminal configuration. Ensure electrostatic discharge handling procedures are strictly followed during installation. Confirm that the mounting torque specifications align with the heatsink interface requirements before assembly.
FET, MOSFET Arrays Selection Notes
Select this component for high-frequency applications requiring low switching losses and high efficiency. Evaluate the thermal management system based on the specified junction-to-case thermal resistance. Verify compatibility with the required gate drive voltages and current capabilities for the intended power stage topology.
FET, MOSFET Arrays Part Context
This module belongs to Microchip's SP6-P series of discrete semiconductor modules. It utilizes a screw mount installation style and provides an isolated package suitable for direct heatsink mounting. The design supports high-power density converters by combining multiple phase legs in a single compact form factor.
FET, MOSFET Arrays Replacement Considerations
Consult official Microchip datasheets for verified substitute part numbers within the same product family. Cross-reference pinouts and thermal characteristics when considering alternative components from other manufacturers.
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