MSCSM70AM07T3AG

FET, MOSFET Arrays Overview

The MSCSM70AM07T3AG is a phase leg silicon carbide (SiC) MOSFET power module with a 700V drain-source voltage rating and a continuous drain current of 353A at 25°C. It features a low on-resistance of 6.4 mΩ and operates within a junction temperature range of -40°C to +175°C. The device utilizes an SP3F package with screw mounting, providing an isolation voltage of 4000Vrms. Key dynamic characteristics include a turn-on delay of 40ns and a fall time of 20ns.

FET, MOSFET Arrays Feature Summary

• Utilizes Silicon Carbide technology for high-speed switching and ultra-low loss performance
• Incorporates Kelvin source connections to facilitate easy gate drive implementation
• Features an internal NTC thermistor for precise junction temperature monitoring
• Employs an Aluminum Nitride substrate to enhance thermal dissipation capabilities

FET, MOSFET Arrays Applications

• Welding converters
• Switched mode power supplies
• Uninterruptible power supplies
• EV motor and traction drive systems

FET, MOSFET Arrays Procurement Notes

Verify the specific datasheet revision A against your design requirements before procurement. Confirm that all specified pin shorting instructions are strictly followed during assembly to ensure proper electrical functionality. Ensure electrostatic discharge handling procedures are implemented throughout the manufacturing process to prevent component damage.

FET, MOSFET Arrays Selection Notes

Select this module for applications requiring high-frequency operation and superior thermal efficiency. The integrated Kelvin source simplifies driver layout, while the low stray inductance supports fast switching transitions. Evaluate the thermal resistance and operating temperature limits to ensure compatibility with the intended heatsinking solution and ambient conditions.

FET, MOSFET Arrays Part Context

This component belongs to Microchip's SiC MOSFET power module family designed for high-power density applications. It offers enhanced performance compared to traditional silicon devices, enabling smaller form factors and higher system efficiencies. The SP3F packaging provides robust mechanical stability and reliable thermal management for demanding industrial environments.

FET, MOSFET Arrays Replacement Considerations

No public confirmed substitute part numbers are available.

FET, MOSFET Arrays FAQ

What is the maximum recommended junction temperature under switching conditions?

The recommended junction temperature under switching conditions is TJmax minus 25 degrees Celsius.

How should the gate pins be configured for optimal performance?

Pins 18, 19, 20, and 22 must be shorted together to establish the common gate connection.

Is there an integrated temperature sensor in the module?

Yes, the module includes an internal NTC thermistor for accurate temperature monitoring.