FET, MOSFET Arrays MSCSM70AM10CT3AG product image

MSCSM70AM10CT3AG

$217.86
  • Description:MOSFET 2N-CH 700V 241A SP3F
  • Series:-

SKU:7eb75c45625b Category: Brand:

  
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MSCSM70AM10CT3AG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET 2N-CH 700V 241A SP3F. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for MSCSM70AM10CT3AG

  • Description:MOSFET 2N-CH 700V 241A SP3F
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tube
  • Technology:Silicon Carbide (SiC)
  • Configuration:2 N Channel (Phase Leg)
  • FET Feature:-
  • Drain to Source Voltage (Vdss):700V
  • Current - Continuous Drain (Id) @ 25°C:241A (Tc)
  • Rds On (Max) @ Id, Vgs:9.5mOhm @ 80A, 20V
  • Vgs(th) (Max) @ Id:2.4V @ 8mA
  • Gate Charge (Qg) (Max) @ Vgs:430nC @ 20V
  • Input Capacitance (Ciss) (Max) @ Vds:9000pF @ 700V
  • Power - Max:690W (Tc)
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:SP3F
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for MSCSM70AM10CT3AG

MSCSM70AM10CT3AG

FET, MOSFET Arrays Overview

The MSCSM70AM10CT3AG is a 700V phase leg silicon carbide (SiC) MOSFET module manufactured by Microchip Technology. It features an N-channel configuration with a continuous drain current of 241A at case temperature and a maximum power dissipation of 690W. The device utilizes the SP3F package for chassis mounting, offering low on-resistance and high-speed switching capabilities typical of SiC technology.

FET, MOSFET Arrays Feature Summary

  • Integrated SiC Power MOSFET with ultra-low loss characteristics
  • High-speed switching performance optimized for efficiency
  • Low RDS(on) for reduced conduction losses

FET, MOSFET Arrays Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • Solar inverters

FET, MOSFET Arrays Procurement Notes

Verify the specific package variant and thermal interface requirements against the official datasheet before procurement. Confirm that the SP3F chassis mount form factor aligns with the target system's mechanical constraints. Ensure gate drive voltage specifications are compatible with the -10V to +25V range defined in the component documentation.

FET, MOSFET Arrays Selection Notes

Select this component for applications requiring high-frequency operation and superior thermal management compared to traditional silicon devices. The SP3F package facilitates efficient heat dissipation through chassis mounting. Consider the 700V blocking capability and 241A current rating when designing the power stage to ensure adequate headroom for peak load conditions.

FET, MOSFET Arrays Part Context

This module belongs to Microchip’s discrete semiconductor module lineup, specifically designed for power electronics. It integrates SiC MOSFET and SBD technologies to enhance system reliability and reduce overall size. The product line targets high-efficiency power conversion systems where thermal performance and switching speed are critical design parameters.

FET, MOSFET Arrays Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing gate drivers and cooling structures if considering alternative modules from the same manufacturer series.

MSCSM70AM10CT3AGMSCSM70AM10CT3AG
$217.86
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