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The MSKD36-16 is a glass-passified rectifier diode module from the Microsemi MSK series, rated for a maximum repetitive reverse voltage of 1600V. It features a single pair of common cathode configuration housed in a D1 base-mounted package. The device supports an average forward current of 36A per diode under half-wave conduction conditions at a case temperature of 104°C. Key electrical characteristics include a typical forward voltage of 1.25V at 100A and a maximum reverse leakage current of 5mA at 150°C. The module utilizes an aluminum oxide DBC ceramic isolated metal baseplate for efficient heat transfer.
Verify component authenticity against official Microsemi documentation due to end-of-life status. Confirm thermal interface requirements match the specified mounting torque values for M5 terminals and M6 heatsink screws. Ensure system design accounts for the standard recovery speed exceeding 500ns. Validate that the D1 package dimensions align with existing mechanical constraints before finalizing procurement plans.
Select this module when high blocking voltage up to 1600V is required alongside moderate current handling capabilities. The common cathode configuration simplifies circuit topology for specific rectification needs. Consider the thermal resistance characteristics and the necessity for baseplate cooling solutions. Evaluate the standard recovery speed suitability against the switching frequency requirements of the target application environment.
This component belongs to the MSK, MSAD, and MSCD36 family of glass-passivated rectifier diode modules. The series offers various voltage ratings ranging from 800V to 1800V, with the MSKD36-16 specifically designated for the 1600V rating. These modules are designed for robust industrial applications requiring reliable power conversion and are characterized by their durable construction and standardized D1 packaging format.
Consult official Microsemi substitution guides for compatible alternatives. Verify that any replacement maintains identical voltage, current, and thermal specifications. Ensure pinout compatibility and mechanical fit within the D1 package form factor.